2Kang S Y,Williams P M,Lee Y C.Modeling and experiment studies onthermosonic flip chip bonding.IEEE Trans.onComponents,Packaging,and ManufacturingTechnology-Part B.1995;4(11):728～733
3RaoR Tummala 中国电子学会电子封装专业委员会译.微电子封装手册[M].,2001..
4Luk C F,Chan Y C,Hung K C.Development of gold to gold interconnection flip chip bonding for chip on suspen2sion assemblies[J].Microeletronics reliability,2002;(12):381～389
5Luk C F,Chan Y C,Hung K C.Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.Microelectronics Reliability,2002;(42):381～389
6Greg Hotchkiss,Gonzalo Amador,Darvin Edwards et al.Wafer level packaging of a tape flip-chip chip scale packages.Microelectronics Reliability,2001;(41):705～713
