摘要
根据测量的锯切力,求出线锯圆周上不同位置处磨粒所受力。将多个磨粒产生的法向力及切向力作用于三维有限元模型,考虑多磨粒的耦合作用,分析切割区的应力场,从而提出了硅晶体线锯切片的损伤层厚度分析模型,实验验证了该模型的正确性。该模型克服了损伤层厚度实验耗资大、费时、损害工件等缺点。同时分析得出,在恒压力进给条件下,随着线锯速度的增加,损伤层厚度略有减小。
Based on the measured forces, the forces acting on single diamond grain were calculated. The three-dimensional finite element model was built up, which considered the coupling effect of forces on multi-grains. The stress states of cutting area were analyzed using finite element method, and then the damage thickness was determined. This model was verified by experimental results. The model overcomes the shortcomings of high cost, time consuming and damage the workpiece in damage thickness test. It is shown that as feed force is a constant, the damage thickness decreases slightly with the increase of wire speed.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2007年第10期1189-1192,共4页
China Mechanical Engineering
基金
国家自然科学基金资助项目(50475132)
山东省自然科学基金资助项目(Y2006F16)
关键词
硅晶体
线锯切片
损伤层厚度
有限元分析
silicon
wiresaw slicing
damage thickness
finite element analysis
