摘要
在对单晶硅的超精密切削加工中,为了优化金刚石刀具参数以利于实现其塑性域切削,运用线弹性断裂力学和有限元法对在不同的刀具前角和切削刃钝圆半径下切削区域的应力场分布和微裂纹扩展规律进行了计算仿真研究,并在此基础上进行了单晶硅的金刚石切削试验以验证仿真分析。结果表明,采用前角范围为-15°～-25°的车刀进行切削有利于抑制原子级尺寸裂纹初步扩展成微裂纹,因此可以提高加工时的脆塑转变临界切深值,有利于实现塑性域切削;而且,切削刃钝圆半径越小加工时的微裂纹就越不易扩展,因此也就容易实现单晶硅的塑性域车削,得到高质量的金刚石切削加工表面。
For the purpose of realizing the brittle material's turning in ductile mode on the basis of optimizing the diamond cutting tool's geometrical parameters, the linear elastic fracture mechanics and finite element method are applied to stimulate the stress distribution and micro-cracks' expanding in the cutting region generated under different rake angles and rounded cutting edge radius. The cutting experiments on single crystal silicon surface are then conducted to verify the stimulation results, which shows that the expanding of micro-cracks can be restrained from atomic-size cracks when utilizing the diamond cutting tools with-15° - -25° rake angles. As a result of increasing the value of the critical depth of cut of brittle-ductile transition, the goal of ductile-mode turning can be achieved. In addition, with a smaller cutting edge radius, the turning of brittle material in ductile-mode can be easily realized, resulting in good diamond turned surface quality.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2002年第12期54-59,共6页
Journal of Mechanical Engineering
基金
国家自然科学基金资助项目(59835180)。
