摘要
测量正在工作的半导体器件温度有很多种方法。这些方法大概可以分为三类:电学方法、光学方法和物理接触方法。介绍了各种方法的物理基础,并且对每种方法的优势、劣势以及空间解析度及需要特别注意的问题等进行了讨论。
There are different methods for mearuring the temperature of the operating semiconductor device. They can broadly divided into three categories： optical, electrical and physically contacting. This proposal discussed the physical fundamentals of those categories. The advantages, disadvantages, spatial resolution and some special issue need to be deal with are also introduced.
出处
《科学技术与工程》
2007年第8期1695-1700,1706,共7页
Science Technology and Engineering
关键词
电学测量方法
光学测量法
半导体
温度
electrical methods optical methods semiconductor temperature
