摘要
提出了一种非金属表面化学镀镍无钯活化工艺，即在常温下，以NaBH4为还原剂，在ABS塑料上沉积活性镍，以此活性镍为活化中心，进行化学镀镍。研究确定了活化液的最佳配方，并利用均匀设计方法确定了在ABS塑料表面化学镀镍最佳工艺条件为：19g／LNi（Ac）2·4H2O，22g/L NaH2PO2，0．02mL／LN2H4·H2O，40mg／L糖精；镀液pH值5．0～5．6，温度70～80℃。采用SEM、XRD、EDS等手段对镀层的形貌、结构、成分及含量进行了表征。结果表明：所得镀液稳定，镀速快，镀镍层均匀，结合力强，说明在ABS塑料表面用该无钯活化新工艺取代钯活化是可行的。
A Pd-free activation process was established for electroless nickel plating of acrylonitrile butadiene styrene (ABS) plastic. The optimized activation bath was explored, while the optimized parameters for the electroless nickel plating of ABS plastic were determined making use of uniform-design method. The morphology, microstructure, and elemental composition of the Ni coating on the ABS plastic were analyzed by means of scanning electron microscopy, X-ray diffraction, and energy dispersive spectroscopy. As the results, it was feasible to generate activated nickel cores on ABS plastic at ambient temperature using NaBH_4 as the reducing agent, which made it possible for the electroless Ni coating to form on the surface of ABS plastic in the presence of the activated Ni cores as the reactive centers. The plating bath had good stability and relatively fast plating rate, while the Ni coating was uniform and well bonded to the substrate. Thus the established Pd-free activation process could be well used for the electroless nickel plating of the ABS plastic.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第11期29-31,共3页
Materials Protection
关键词
ABS塑料
化学镀镍
无钯活化
均匀设计
ABS plastic
electroless nickel plating
Pd-free activation
uniform-design method
