摘要
非金属表面要进行化学镀时,传统的工艺是采用贵金属Pd、Ag等催化剂、经敏化、活化处理,在非金属表面上形成具有催化活性的金属晶核,然后才能进行化学镀。但是此法成本昂贵,溶液不稳定,操作繁复,难控制。本文研究了用n型半导体氧化物如ZnO、MgO、Ni_2O_3和SnO_2,来代替贵金属作化学镀时的催化剂。研究表明,使用SnO_2作催化剂,用甲醛作还原剂,在陶瓷表面进行化学镀铜时,具有镀层沉积速度快,大面积镀复合格率高,镀层质量好,与基体结合力特别强等特点。此外,对于这一催化化学镀铜的机理也作了详细的探讨。最后认为,由于其工艺简单、成本低廉、性能优良,在某些非金属化学镀方面,可以用半导体催化剂来取代贵金属催化剂。
In conventional process of nonmetal electroless plating, precious metals such as Pd and Ag are used as catalyst agents, and, only after the catalytic activated metal crystal nuclei are formed on nonmetal surface through sensitization and activation treatments, then electroless plating can be done. But it is too expensive, the solution is unstable, the operation is heavy and complicated and is hard to control. N type semiconductor oxides, such as ZnO, MgO, Ni_2O_3 and SnO_2, are there- fore tested to be used as catalyst in electroless plating to substitute for precious metals. Tests show that, when SnO_2 is adopted as catalyst and formalin as reducing agent, the electroless Cu plating on ceramic surface would result in fast deposition speed, good qualified rate for large sur- face parts to be plated, high quality of deposit layer and excellent adherence to the base. The mechanism of such process is also discussed in detail. It is concluded that semiconductor cataly- sts can substitute for precious metal catalysts in some nonmetal electroless plating due to its sim- plicity, low cost and other good performances.
出处
《电镀与环保》
CAS
CSCD
1989年第1期19-21,共3页
Electroplating & Pollution Control
