摘要
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。阐述了激光软钎焊的原理,简要介绍了CO2激光、YAG激光及半导体激光软钎焊系统各自的工艺特点,分析了各种激光软钎焊方法的不足及需要进一步研究解决的问题,并对激光软钎焊的发展趋势进行了分析预测。特别是解决了激光软钎焊的激光实时监控、焊点缺陷实时检测、焊接智能化等技术问题后,将会得到更为广泛的应用。
Laser soldering technology has been found an important application in micro-electronic joining and packaging. The principle of laser soldering was addressed, and the characteristics of CO2 laser system, YAG laser system and diode laser system were also presented. The emphasis was focused on the characteristics of laser soldering processes and their problems to be studied, and the shortcomings of laser systems were analyzed. It will have wider application when some problems, i.e. simultaneous controlling to laser soldering system, real time monitoring to the joint defects and the intelligent soldering are solved respectively,
出处
《焊接》
北大核心
2006年第8期13-17,21,共6页
Welding & Joining
