摘要
测定了铜在单相α合金（Al-1．5wt％Cu-0．4wt％Si）和α＋Si两相合金（Al-1．5wt％Cu．12．5wt％Si）中的扩散系数。单相α合金扩散偶（Al-3．0wt％Cu-0．4wt％Si／Al-0．4wt％Si）和α＋si两相合金扩散偶（Al-3．0wt％Cu．12．5wt％Si／Al-12．5wt％Si）在450—540℃条件下保温72—144h后，用电子探针测定铜原子的浓度分布，并由此计算铜原子在这两种基体中的扩散系数。测定结果表明，硅相的存在能够显著提高铜在该合金中的扩散速度，提高的幅度取决于硅相的体积分数和形貌。
Copper diffusion speed in both α phase （ Al-1.5wt% Cu-0. 4wt% Si ） and （ α ＋ Si ） crystal two phase （ Al- l. 5wt% Cu-12. 5wt% Si） alloys were measured. Two diffusion couples of A1-3.0wt% Cu-0.4wt% Si vs Al-0. 4wt% Si both sides of which are α single phase regions and Al-3.0wt% Cu-12. 5wt% Sivs All-12. 5wt% Si both sides of which are （α ＋ Si） two phase regions were heated at 450-540 ℃for 72 - 144 h,and then measured by electron probe microanalysis to obtain the copper atom concentration profiles. Copper diffusion coefficient could be calculated from these profiles. The results show that silicon phase particles can greatly increase the copper diffusion speed, copper has very high diffusivity in the silicon phase, and silicon particles are shortcuts for copper diffusion in the alloy. How much the silicon phase can increase copper diffusivity depends on its volume percentage and morphology.
出处
《金属热处理》
EI
CAS
CSCD
北大核心
2006年第6期13-16,共4页
Heat Treatment of Metals
