摘要
采用扩散焊接方法对钼铜异种材料进行了焊接,研究了直接焊接和加镍作为中间层焊接对焊接接头界面显微组织的影响,通过SEM、EDS、EPMA、XRD等测试方法对其显微结构进行了表征.结果表明,直接焊接时,焊接界面结合紧密,Mo、Cu原子之间相互扩散形成扩散层,接头断裂发生在扩散层,由于柯肯达尔效应作用,在铜侧形成少量孔洞,孔洞的存在使焊接接头性能降低;加镍中间层焊接时,接头抗拉强度高于直接焊接时抗拉强度,Mo/Ni和Ni/Cu界面结合紧密,Mo/Ni界面形成固溶体层,接头断裂发生在Mo/Ni界面处,断口呈典型的脆性断裂特征.
In this paper, Mo and Cu were welded together by diffusion welding with or without a Ni interlayer. SEM,EDS,EPMA,XRD were used to characterize the structure and the element distribution of the interface zone. The results showed that the Mo/Cu joint combined homogeneously by diffusion welding, the diffusion lay- er formed at the interface due to Mo atoms and Cu atoms inter-diffusion. There were some micro-voids on the copper side of the joint due to the role of kirkendall effect, and the voids reduced the performance of the joint. For the Mo/Ni/Cu joint, Mo/Ni and Ni/Cu interface were linked together, and the tensile strength of the Mo/ Ni/Cu joint was higher than the Mo/Cu joint, because the added nickel eased the thermal stress of the joint. A solid solution was formed at the Mo/Ni interface where a joint brittle fracture took place.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2012年第4期61-64,共4页
Materials Science and Technology
基金
国家自然科学基金资助项目(11072228)
中央高校基本科研业务费专项资金资助项目(2011-IV-038)
关键词
扩散焊接
钼与铜
显微组织
Ni中间层
diffusion welding
Mo and Cu
microstructure
Ni interlayer
