摘要
在化学镀铜溶液中添加CHN—881型稳定剂,经大批量和高负荷的实际生产考核,溶液稳定好,从而实现了用单一络合剂在室温下稳定地进行化学镀铜。
Electroless Cu-plating solution has excellent stability by adding CHN-881 stabilizer, tested through a large number of practical production of high load. Thus the stable elect-roless Cu-plating under room temperatures with individual complexing agent has been realized.
出处
《表面技术》
EI
CAS
CSCD
1990年第3期44-48,共5页
Surface Technology
