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快速热氮化超薄SiO_2膜特性的研究 被引量:6

Study on Characteristics of Ultra-thin RTN SiO_2 Films
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摘要 本文主要研究了超薄快速热氮化(Rapid Thermal Nitridation)SiO_2膜在高电场下的电特性和抗辐照特性,采用AES和XPS等技术分析了RTN SiO_2膜的成份和结构。与同厚SiO_2膜相比,RTN SiO_2膜具有许多明显的优点,在同样条件下,当电场强度E≈1.5×10~7V/cm时,击穿时间t_(bd)比SiO_2的约高两个量级;在经过剂量高达10~7rad的Co^(60)辐照后,SiO_2膜的界面态密度及漏电流均增大1—2个量级,而RTN SiO_2膜的变化非常小。 The characteristics of the ultra-thin (10nm) Rapid Thermal Nitrided SiO_2 films underhigh electric field stress are studied.The composition and structure of RTN SiO_2 film havebeen analysed by means of AES and XPS.A new technique to obtain the ultra-thin RTNSiO_2 films with high quality is presented.The RTN SiO_2 films have many advantages in comparisonwith the SiO_2 films of the same thickness.The breakdown time t_(hd) of the film at thehigh electric field of 1.5×10~7 V/cm is about two orders of magnitude higher than that ofSiO_2, which are stressed under the same conditions. With conventional SiO_2 film, the irradiationof Co^(60) upto 10~6 and 10~7 rad increases the interface state density and leakage current by1-2 orders of magnitude, while with the RTN SiO_2 films the changes are very small.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1990年第8期627-634,共8页 半导体学报(英文版)
关键词 SIO2膜 热氮化 电子陷阱 击穿时间 Rapid thermal nitridation Electron trap High electic field Breakdown time Density of interface state irradiation
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  • 1冯文修,陈蒲生,黄世平.用快速热工艺氮化超薄SiO_2膜的研究[J].华南理工大学学报(自然科学版),1995,23(12):121-126. 被引量:1
  • 2冯文修,陈蒲生,黄世平.快速热氮化超薄SiO_2膜的氮分布和氮化机理的研究[J].Journal of Semiconductors,1997,18(4):269-274. 被引量:3
  • 3Moslehi M M, Saraswat K C. Thermal nitridation of Si and SiOz for VLSI [ J ]. IEEE Trans Electron Devices,1985 ,ED-32 : 106.
  • 4Nulman J,Krusius J P. Rapid thermal nitridation of thin thermal silicon dioxide films [J]. Appl Phys Lett, 1985,47(2) :148 - 150.
  • 5Lenlinger M, Snow E H. Fowler-Nordheim tunneling into thermally grown SiO2 [J]. J Appl Phys, 1969,40:278 -283.
  • 6Weinberg Z A. On tunneling in metal-oxide-silicon structures [J]. J Appl Phys,1982,53(7) :5 052 -5 066.
  • 7Sze S M. Current transport and maximum dielectric strength of silicon nitride filrns [ J]. J Appl Phy, 1967,38 (7) :2 951 -2 956.
  • 8吾立峰,半导体学报,1988年,9卷,4期,412页
  • 9商陆民,半导体技术,1987年,4期,29页
  • 10Wong H,Appl Surf Sci,1993年,72卷,49页

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