期刊文献+

电子封装中的点胶过程分析和控制 被引量:13

Analysis and Control of Dispensing Process in Electronics Packaging
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摘要 针对时间/压力点胶系统影响因素较多、缺乏整体一致性、难于控制的缺点,提出了SPC和Run by Run的PI算法相结合的控制方法。通过对时间/压力点胶机结构特点、胶体流变特性、气压的动态特征及其影响因素进行综合分析,在胶体剪切应力和剪切应变的经验关系上建立了有效的流量模型。分析了一般控制方法,建立体积估计模型,运用Regression-based SPC和PI算法组合控制。实验表明,在时间/压力方式下微量点胶能取得很好的效果。 The time-pressure dispensing system in electronics packaging is dealt with. To solve the problems of multi-factors, consistency and control, a combination of SPC and Run by Run P1 control is builded. The characteristic of the adhesive, the factors affecting dispensing consistence and the air dynamics in time/pressure dispense are analyzed.The flow rate is established based on the empirical equation between the shear stress and shear rate. Then the control model is proposed according the flow rate, and the combination control method is established. Experiments show that it can be applied well to the small mount dispensing.
出处 《控制工程》 CSCD 2005年第5期405-408,共4页 Control Engineering of China
基金 国家自然科学基金资助项目(50390064 50390063) 国家杰出青年基金资助项目(50429501) 国家973重点基础研究计划资助项目(2003CB716207)
关键词 点胶 非牛顿特性 流变特性 dispense non-Newtonian rheological behavior
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参考文献12

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