摘要
IC制造设备中的关键零部件对于其内外表面粗糙度有着很高的要求。传统的研磨抛光技术很难达到这一要求,从而直接影响了IC制造设备的国产化进程。化学研磨抛光技术作为一种新兴的材料表面处理技术,通过化学药液浸蚀方式,可以在短时间内完成对于各种复杂形状零件的内外表面研磨抛光,同时可以使工件表面满足较高的物理化学性能要求,非常适合于IC制造设备中高真空度、高洁净度要求的零部件生产加工。
Some key parts of IC Manufacturing Equipment have critical requirement on their roughness of interior and exterior surfaces, which is too difficult to be met by the traditional millering and polishing methods, resulting in the blocking of the localization of such equipments. Chemical Millering Polishing （CMP）, which is a new technology in material surface processing area, is able to treat the interior and exterior surface of all shapes of parts, by dipping-eroding the parts into certain chemical solution. The parts treated have excellent performance in both physics and chemical, and are suitable to the usage of IC Manufacturing Equipment, meeting the requirement of high vacuum and high cleanness.
出处
《电子工业专用设备》
2005年第9期42-45,共4页
Equipment for Electronic Products Manufacturing
关键词
化学研磨抛光
IC制造设备
洁净度
真空度
技术优势
Chemical Millering Polishing
IC Manufacturing Equipment
Vacuum
cleanness
technical advantage
