摘要
PKG内部分层是电子封装中很普遍的一种现象,也是必须要解决的一种主要缺陷,它会严重影响电子封装的可靠性。造成和影响PKG分层的原因很多,对封装树脂与PKG分层的关系进行了探讨。经研究表明,降低封装树脂的应力、改善封装树脂的吸湿性和提高封装树脂的粘接力是改善PKG内部分层现象的有效方法。
Delamination is a common phenomenon in EMC package, one of the main defects needed to be solved as well. It can affect the reliability of electron PKG severely. There are many reasons which can cause delamination. This article will discuss the relationship between resin and PKG delamination. Investigation indicated that reducing resin stress, to modify moisture absorption of resin, and enhance resin adhesion can modify delamination phenomenon effectively.
出处
《电子工业专用设备》
2005年第9期22-25,共4页
Equipment for Electronic Products Manufacturing
关键词
封装树脂
分层
关系
探讨
Resin
Delamination
Relationship
Discuss
