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化学气相淀积法合成氮化铝薄膜及其工艺设计 被引量:1

A Technical Design and Experiment of the Chemical Vapor Deposition of AIN Film
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摘要 对AIBr3-NH3N2体系化学气相淀积法合成AIN膜进行了热力学分析和工艺设计,研究了在不同淀积温度和体系总压时,体系中主要气态物种的平衡分压和AIN膜的理论淀积速率与源温和载气流量的关系,并与微波等离子体化学气相淀积AIN膜的实验结果进行了比较. Thermodynamic analysis and a technical design and experimental results for the chemical vapor deposition(CVD) of AIN film from AIBr2-NH3-N2 system are presented.At various deposition temperatures,input gas flow rates and total pressure,the equilibrium partial pressures of the major gaseous species are calculated.The effects of precursor temperature and gas flow rate on the theoretical deposition rate of AIN film are estimated.And theoretical results are compared with those of the experiments by a microwave plasma CVD of AIN thin films.
出处 《高等学校化学学报》 SCIE EI CAS CSCD 北大核心 1996年第6期838-842,共5页 Chemical Journal of Chinese Universities
基金 国家自然科学基金
关键词 化学气相淀积 氮化铝 热力学分析 CVD 薄膜 Chemical vapor deposition,AIN,Thermodynamic analysis
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参考文献2

  • 1Zhang W,J Crystal Growth,1993年,130卷,308页
  • 2孟广耀,中国科学技术大学学报,1990年,10卷,1期,1页

同被引文献8

  • 1张随新,陈国平.磁控反应溅射制备氧化锡膜的工艺研究[J].真空科学与技术,1995,15(6):415-419. 被引量:5
  • 2McGeoch S P, Placido F, et al. Coatings for the Protection of Diamond in High-Temperature Environments. Diamond Relat Mater, 1999, 8:916-919
  • 3Fomin A A, Akhmator V, et al. Magnetron Sputtering System Stabilization for High Rate Deposition of AlN Films.Vacuum, 1998, 49(3): 247-251
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  • 6沃森JL 克恩W.薄膜加工工艺[M].北京:机械工业出版社,1987..
  • 7Sugiyama K, Taniguchi K, et al. Preparation of Orientated Aluminium Nitride Films by Radio-Frequency Reactive Sputtering. J Mate Sci Lett, 1990, 9:489-492
  • 8赵强,范正修,WANGMingli,Kyung-KuYOON,Jae-GuKIM,Seong-KukLEE,Kyung-HyunWHANG.用KrF准分子脉冲激光在低基板温度下制备AlN薄膜的研究[J].功能材料,2000,31(B05):101-102. 被引量:2

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