摘要
采用脉冲电沉积法制备了韧性较好的纳米晶镍镀层。考察了脉冲峰值电流密度对纳米晶镍镀层织构和硬度的影响。结果表明,随着脉冲峰值电流密度的增加,Ni(111)晶面择优取向程度逐渐增强,晶粒显著减小,镀层的硬度逐渐增加。纳米晶镍镀层硬度与晶粒尺寸的关系符合经典的Hall-Petch效应。
Nanocrystalline Ni deposits with better ductility were produced by pulse electrodeposition method. The effects of pulse peak current density on the texture and hardness of electrodeposited Ni were investigated. Results show that (111) growth orientation was increased and the grain size of nanocrystalline Ni was decreased gradually with the increase in pulse peak current density, which results in the gradual increase in hardness of Ni deposits. Moreover, the relation between hardness and grain size of nickel is in good agreement with Hall-Petch hardening effect.
出处
《电镀与精饰》
CAS
2005年第3期40-42,共3页
Plating & Finishing
