摘要
金刚石线锯能够对硬脆材料进行精密、窄锯缝切割 ,已逐渐取代内圆锯 ,广泛应用于半导体和光电池切片加工 ,并在陶瓷、石英、木材等加工中显示出独特优势。对国内、外金刚石线锯研究现状进行总结 。
Diamond wire saw can critically slice hard-brittle material with low kerf-loss.Diamond wire machining is emerging as a leading technology for wafer production in semiconductor and photovoltaic industry.It is a potential method for the machining of ceramics,quartz,stone,etc.A survey of published work is provided,and the state-of -the-art development of diamond wire machining technologies is introduced.
出处
《现代制造工程》
CSCD
北大核心
2004年第6期112-115,共4页
Modern Manufacturing Engineering
基金
山东省优秀中青年科学家科研奖励基金资助项目 (0 2BS0 66)
关键词
金刚石线锯
硬脆材料
Diamond wire saw Hard-brittle material
