摘要
试验研究了三种半导体致冷电对金属化系统的拉伸强度，其中铋─镍─锡金属化系统与半导体致冷材料粘接强度最高，超过原始棒状材料的拉伸强度，它是半导体致冷器电对的最好的金属化系统．
The adhesive strength of three thermeolectric cooling couple metallization systems have ho tested. The adhesive strength of Bi-Ni-Sn metallization system is the highest,and exed the tensil strength of the rod form thermoelectric cooling material ingot,for this reason, the Bi-Ni-Sn metallization system is the best for the thermoelectric cooling couple metallization.
出处
《哈尔滨工业大学学报》
EI
CAS
CSCD
北大核心
1994年第5期73-76,共4页
Journal of Harbin Institute of Technology
关键词
金属化层
粘接强度
半导体
致冷材料
Thermoelectric cooling couple metallization
metallized layer adhesive strengthLiu Zhemao, born in 1935,graduatued from the Department of Semiconductor Physies of JiLin University in 1961.Hie resesch interest include semiconductor devices and their reliab
