摘要
论述了半导体硅片加工机床的现状与发展趋势,研究了金刚线切割半导体的必要性。通过金刚线切割硅片的原理以及切割技术参数,分析了金刚线切片机的关键技术和难点技术,设计出了适用于半导体硅片加工的金刚线切片机。实践证明,采用金刚线切片机加工半导体硅片满足精度需要,提高了加工效率,降低了使用成本。
This paper discusses the current situation and development trends of semiconductor silicon wafer processing machine tools,as well as the necessity of researching and developing diamond wire slicing machines.Through the principle of diamond wire cutting of silicon wafers and cutting technical parameters,the key technologies and difficult technologies of diamond wire slicing machines are analyzed,and a diamond wire slicing machine suitable for semiconductor silicon wafer processing is designed.Practice has proven that using a diamond wire slicing machine to process semiconductor silicon wafers can meet the accuracy requirements,improve processing efficiency,and reduce usage costs.
作者
刘秀坤
LIU Xiukun(Dalian Linton NC Machine Co.,Ltd.,Dalian 116036,China)
出处
《电子工业专用设备》
2025年第1期7-12,54,共7页
Equipment for Electronic Products Manufacturing
关键词
金刚线
切片机
张力控制
切割辊
同步控制
Diamond wire
Slicing machine
Tension control
Cutting roller
Synchronous control
