摘要
介绍了无铅焊接材料的研究背景 ,并以发展前景良好的候选材料Sn Ag ,Sn Bi,Sn Zn系共晶合金为例 ,介绍了无铅焊接材料的研究现状和存在的问题。研究表明 ,Sn 3 .5 %Ag基合金具有良好的力学性能 ,但熔点偏高 ;Sn 5 8%Bi基合金的机械性能略差 ,并且熔点太低 ;Sn 8%Zn基合金虽然有合适的熔点 ,但润湿性差。本文还简略地介绍了由日本开发的材料设计系统以及在无铅材料开发中的作用 。
The historical background of the Pb free solders, and its present statues and existing problems of research for the promising candidates of the Sn Ag, Si Bi and Sn Zn systems were introduced. It shows that, Sn 3 5%Ag based alloy has favorable mechanical properties but higher melting point, and Sn 58%Bi based alloy has both lower mechanics properties and melting point, and Sn 8%Zn based alloy has more suitable melting point but the infiltration ability is too low. The exploitation of materials design system in Japan and its application for Pb free solders exploitation are also introduced briefly.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2003年第6期804-808,共5页
Chinese Journal of Rare Metals
基金
福建省青年科技人才创新基金项目 ( 2 0 0 1J0 2 8)
华侨大学高层次人才科研启动项目
