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Atomic surface of diamond induced by novel green photocatalytic chemical mechanical polishing with high material removal rate 被引量:1
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作者 Zhibin Yu Zhenyu Zhang +6 位作者 Zinuo Zeng Cheng Fan Yang Gu Chunjing Shi Hongxiu Zhou Fanning Meng Junyuan Feng 《International Journal of Extreme Manufacturing》 2025年第2期661-676,共16页
Atomic surfaces are strictly required by high-performance devices of diamond.Nevertheless,diamond is the hardest material in nature,leading to the low material removal rate(MRR)and high surface roughness during machin... Atomic surfaces are strictly required by high-performance devices of diamond.Nevertheless,diamond is the hardest material in nature,leading to the low material removal rate(MRR)and high surface roughness during machining.Noxious slurries are widely used in conventional chemical mechanical polishing(CMP),resulting in the possible pollution to the environment.Moreover,the traditional slurries normally contain more than four ingredients,causing difficulties to control the process and quality of CMP.To solve these challenges,a novel green CMP for single crystal diamond was developed,consisting of only hydrogen peroxide,diamond abrasive and Prussian blue(PB)/titania catalyst.After CMP,atomic surface is achieved with surface roughness Sa of 0.079 nm,and the MRR is 1168 nm·h^(-1).Thickness of damaged layer is merely 0.66 nm confirmed by transmission electron microscopy(TEM).X-ray photoelectron spectroscopy,electron paramagnetic resonance and TEM reveal that·OH radicals form under ultraviolet irradiation on PB/titania catalyst.The·OH radicals oxidize diamond,transforming it from monocrystalline to amorphous atomic structure,generating a soft amorphous layer.This contributes the high MRR and formation of atomic surface on diamond.The developed novel green CMP offers new insights to achieve atomic surface of diamond for potential use in their high-performance devices. 展开更多
关键词 photocatalytic chemical mechanical polishing DIAMOND photocatalytic Fenton reaction material removal rate atomic diamond surface
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IMPROVING MATERIAL REMOVAL RATE OF BRITTLE CERAMICS THROUGH HONING INCIDENTAL TENSILE STRESSES
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作者 于爱兵 徐燕申 +1 位作者 林彬 王龙山 《Transactions of Tianjin University》 EI CAS 1998年第2期41-44,共4页
The stress intensity factors and stress conditions of machining cracks are analyzed by fracture mechanics on the basis of honing characteristics and of brittle ceramic mechanical behavior.Because the honing incidental... The stress intensity factors and stress conditions of machining cracks are analyzed by fracture mechanics on the basis of honing characteristics and of brittle ceramic mechanical behavior.Because the honing incidental tensile stresses effectively decrease the critical grinding stresses and increase the stress intensity factors of machining cracks,the honing process can be carried out easily.The results show that honing can be an efficient machining method for brittle materials. 展开更多
关键词 CERAMICS HONING incidental tensile stress material removal rate
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On investigating the soda-lime shot blasting of AZ31 alloy:Effects on surface roughness,material removal rate,corrosion resistance,and bioactivity 被引量:2
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作者 Gurmider Singh Sunpreet Singh +1 位作者 Chander Prakash Seeram Ramakrishna 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2021年第4期1278-1290,共13页
In the present study,a novel method of surface finish improvement is proposed using shot blasting of soda lime(SBSL)beads on the Mg-AZ31 alloy.The effect of the soda blasting process parameters,such as blast pressure,... In the present study,a novel method of surface finish improvement is proposed using shot blasting of soda lime(SBSL)beads on the Mg-AZ31 alloy.The effect of the soda blasting process parameters,such as blast pressure,stand-off distance,and blast duration,have been studied in-response of material removal rate(MRR)and surface roughness(SR)and corresponding statistical models have been obtained.The multi-objective optimization has also been performed to obtain parameters for maximum MRR and minimum SR.The corrosion behavior of the treated specimens has been performed to study their in-vitro biodegradability in simulated body fluid(SBF)for 1,3,7,10,15,and 21 days.The wettability study of the SBSL treated samples has been investigated using sessile drop methodology.Further,cell adhesion test has also been performed to study the biocompatibility characteristics of the SBSL treated samples using Huh7 liver cell lines.Based on obtained quantitative data as well as scanning electron microscopy analysis of treated samples,the SBSL treatment of the AZ31 alloy has been found highly useful in producing biocompatibility surfaces along with desirable morphological features. 展开更多
关键词 AZ31 Soda-lime Surface roughness material removal rate Corrosion WETTABILITY BIOCOMPATIBILITY
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Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers 被引量:1
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作者 LI Yan JIE Wanqi +1 位作者 KANG Renke GAO Hang 《Rare Metals》 SCIE EI CAS CSCD 2011年第4期381-386,共6页
The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a... The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a peak of frictional coefficient at the early stage of scratch, and increasing the vertical force will result in the increase of peak value correspondingly. The fluctuation phenomenon of frictional coefficient is generated at high vertical force. The lateral forces show the apparent twofold and threefold symmetries on (110) and (111) planes, respectively. To obtain high surface quality, low polishing pressure and hard direction (〈 T10 〉 directions on (110) plane and 〈 112 〉 directions on (111) plane) should be selected, and to achieve high material removal rate, high polishing pressure and soft direction (〈001〉 directions on (110) plane and 〈 121 〉 directions on (111) plane) should be selected. 展开更多
关键词 cadmium compounds single crystals nanoscratch tests frictional coefficient material removal rate surface quality ANISOTROPY
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Material Removal Rate Prediction of Electrical Discharge Machining Process Using Artificial Neural Network
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作者 Azli Yahya Trias Andromeda Ameruddin Baharom Arif Abd Rahim Nazriah Mahmud 《Journal of Mechanics Engineering and Automation》 2011年第4期298-302,共5页
This article presents an Artificial Neural Network (ANN) architecture to model the Electrical Discharge Machining (EDM) process. It is aimed to develop the ANN model using an input-output pattern of raw data colle... This article presents an Artificial Neural Network (ANN) architecture to model the Electrical Discharge Machining (EDM) process. It is aimed to develop the ANN model using an input-output pattern of raw data collected from an experimental of EDM process, whereas several research objectives have been outlined such as experimenting machining material for selected gap current, identifying machining parameters for ANN variables and selecting appropriate size of data selection. The experimental data (input variables) of copper-electrode and steel-workpiece is based on a selected gap current where pulse on time, pulse off time and sparking frequency have been chosen at optimum value of Material Removal Rate (MRR). In this paper, the result has significantly demonstrated that the ANN model is capable of predicting the MRR with low percentage prediction error when compared with the experimental result. 展开更多
关键词 Electrical discharge machining artificial neural network material removal rate.
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Preparation of CeO_(2) abrasives by reducing atmosphere-assisted molten salt method for enhancing their chemical mechanical polishing performance on SiO_(2)substrates 被引量:4
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作者 Ning Xu Jiahui Ma +2 位作者 Qi Liu Yuxin Luo Yongping Pu 《Journal of Rare Earths》 SCIE EI CAS CSCD 2023年第10期1627-1635,I0006,共10页
Ce^(3+)as the active site on the CeO_(2)abrasive surface is the key to enhancing the material removal rate(MRR).The CeO_(2)abrasives with high chemical activity were prepared by the molten salt method under a reducing... Ce^(3+)as the active site on the CeO_(2)abrasive surface is the key to enhancing the material removal rate(MRR).The CeO_(2)abrasives with high chemical activity were prepared by the molten salt method under a reducing atmosphere.The crystal structure and morphology of CeO_(2)abrasive s were characterized by X-ray diffraction(XRD),scanning electron microscopy(SEM),transmission electron microscopy(TEM),Fourier transform infrared spectroscopy(FT-IR),ultraviolet—visible diffuse reflectance spectroscopy(UV-Vis DRS),and X-ray photoelectron spectroscopy(XPS).The CeO_(2)abrasives were obtained under different atmospheres(Air,Ar,and Ar/H_(2)).With the enhancement of the reducing atmosphere,the morphology of the abrasives transforms from spherical to octahedral,while more oxygen vacancies and Ce^(3+)are generated on the surface of CeO_(2)abrasives.The CMP experiments show that the MRRs of the CeO_(2)-Air,CeO_(2)-Ar,and CeO_(2)-Ar/H_(2)abrasives on SiO_(2)substrates are 337.60,578.74,and 691.28 nm/min,respectively.Moreover,as confirmed by atomic force microscopy(AFM),the substrate surfaces exhibit low roughness(20.5 nm)after being polished using all of the prepared samples.Especially,the MRR of CeO_(2)-Ar/H_(2)abrasives is increased by 104.76%compared with CeO_(2)-air abrasives.The improved CMP performance is attributed to the increased Ce^(3+)concentration and the octahedral morphology of the abrasives enhancing the chemical reaction and mechanical removal at the abrasive-substrate interface. 展开更多
关键词 CeO_(2) Chemical mechanical polishing(CMP) Reducing atmosphere material removal rate(MRR) Molten salt method Rare earths
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Experimental Study of Material Removal Process of Fused Silica Glass Using MR Jet Polishing System
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作者 LEE Jung-Won CHO Yong-Kyu +2 位作者 CAI Yue CHOI Seung-Bok CHO Myeong-Woo 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2012年第S1期604-607,共4页
Recently,there has been an investigation of polishing processes that has considered new ultra-precision polishing technology for micro parts and optical parts such as those with aspheric and complex shapes.One suitabl... Recently,there has been an investigation of polishing processes that has considered new ultra-precision polishing technology for micro parts and optical parts such as those with aspheric and complex shapes.One suitable means of polishing complex shapes is to use a jet of abrasive fluid.However,aerodynamic disturbances and radial spreading are generated by the unstable polishing process of the jet on the surface of the workpiece when it is being polished.A method of jet stabilization has been proposed in which the original nozzle form of a jet of magnetorheological(MR)fluid contains abrasive particles that are magnetized using a magnetic.This paper details the design of an MR jet polishing system that uses an electromagnet,a nozzle,and a hydraulic unit to stabilize a slurry jet based on MR fluid, Second,for silica glass,the polishing spot and section profile are analyzed and the effect of the MR fluid jet polishing process is evaluated.The results of the experiment show that the removal profile is W-shaped and that,in this case,a stable can be proof of a distance of several tens of millimeters from the nozzle.Such results show the possibility of applying the proposed polishing method using MR fluids in ultra-precision micro and optical parts production processes. MR jet polishing shows great potential for use as a new type of precision surface polishing technology.In particular,this is a highly valuable process for the polishing of complex shapes such as micro parts,concaves parts,and cavities. 展开更多
关键词 magnetorheological(MR)fluids optical part fused silica glass material removal rate MR jet polishing system
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Multi-objective parameter optimization of abrasive water jet polishing for fused silica
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作者 LI Qian YAO Peng +6 位作者 DENG Hong-xing FENG Chen-yu XU Chong-hai QU Shuo-shuo YANG Yu-ying ZHU Hong-tao HUANG Chuan-zhen 《中国光学(中英文)》 北大核心 2025年第5期1185-1199,共15页
As a non-contact ultra-precision machining method,abrasive water jet polishing(AWJP)has signi-ficant application in optical elements processing due to its stable tool influence function(TIF),no subsurface damage and s... As a non-contact ultra-precision machining method,abrasive water jet polishing(AWJP)has signi-ficant application in optical elements processing due to its stable tool influence function(TIF),no subsurface damage and strong adaptability to workpiece shapes.In this study,the effects of jet pressure,nozzle diameter and impinging angle on the distribution of pressure,velocity and wall shear stress in the polishing flow field were systematically analyzed by computational fluid dynamics(CFD)simulation.Based on the Box-Behnken experimental design,a response surface regression model was constructed to investigate the influence mech-anism of process parameters on material removal rate(MRR)and surface roughness(Ra)of fused silica.And experimental results showed that increasing jet pressure and nozzle diameter significantly improved MRR,consistent with shear stress distribution revealed by CFD simulations.However,increasing jet pressure and impinging angle caused higher Ra values,which was unfavorable for surface quality improvement.Genetic algorithm(GA)was used for multi-objective optimization to establish Pareto solutions,achieving concurrent optimization of polishing efficiency and surface quality.A parameter combination of 2 MPa jet pressure,0.3 mm nozzle diameter,and 30°impinging angle achieved MRR of 169.05μm^(3)/s and Ra of 0.50 nm.Exper-imental verification showed prediction errors of 4.4%(MRR)and 3.8%(Ra),confirming the model’s reliabil-ity.This parameter optimization system provides theoretical basis and technical support for ultra-precision polishing of complex curved optical components. 展开更多
关键词 ABRASIVE computational fluid dynamics tool influence function material removal rate surface roughness
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A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure
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作者 Shuangchen ZHAO Yebing TIAN +1 位作者 Shuang LIU Pengzhan WANG 《Frontiers of Mechanical Engineering》 2025年第3期171-186,共16页
A material removal mechanism is a prerequisite to maintaining high-quality surfaces for high-shear and low-pressure grinding using body-armor-like grinding wheels(BAGWs).However,the pressure distribution and material ... A material removal mechanism is a prerequisite to maintaining high-quality surfaces for high-shear and low-pressure grinding using body-armor-like grinding wheels(BAGWs).However,the pressure distribution and material removal efficiency for machining brittle materials using BAGWs remain unclear.This research investigated two types of elastic deformations during grinding by analyzing the contact mechanism between BAGWs and the workpiece.Additionally,the model of elastohydrodynamic pressure distribution was refined,and the material removal mechanism for machining brittle materials,incorporating the maximum undeformed chip thickness,was revealed.A material removal rate(MRR)model was established based on Hertzian contact,ductile-brittle transition,and spherical indentation theory.The theoretical model was validated through single-factor experiments utilizing a high-shear and low-pressure grinding experimental platform.At a normal grinding force of 15 N and a grinding speed of 10 m/s,the MRR could reach up to 0.276 mm3/s.The experimental results revealed that the model could accurately predict the MRR under various grinding parameters,with an average prediction error of 8.5%. 展开更多
关键词 elastohydrodynamic pressure brittle-ductile transition material removal rate body-armor-like grinding wheel high-shear and low-pressure grinding
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NOVEL METHOD FOR DYNAMIC OPTIMIZATION OF STABILITY IN HIGH-SPEED MILLING SYSTEM 被引量:4
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作者 宋清华 万熠 +2 位作者 艾兴 赵军 刘战强 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI 2009年第3期184-191,共8页
Considering the self-excited and forced vibrations in high-speed milling processes, a novel method for dynamic optimization of system stability is used to determine the cutting parameters and structural parameters by ... Considering the self-excited and forced vibrations in high-speed milling processes, a novel method for dynamic optimization of system stability is used to determine the cutting parameters and structural parameters by increasing the chatter free material removal rate (CF-MRR) and surface finish. The method is hased on the theory of the chatter stability and the semi-bandwidth of the resonant region. The objective function of the method is material removal rate(MRR),the constraints are chatter stability and surface finish, and the optimizing variables are cutting and structural parameters. The optimization procedure is stated. The method is applied to a milling system and CF-MRR is increased 18.86%. It is shown that the influences of the chatter stability and the resonance are simultaneously considered in the dynamic optimization of the milling system for increasing CF-MRR and the surface finish. 展开更多
关键词 RESONANCE milling (machining) stability dynamic optimization regenerative chatter material removal rate (MRR)
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Optimization of micro milling electrical discharge machining of Inconel 718 by Grey-Taguchi method 被引量:3
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作者 林茂用 曹中丞 +3 位作者 许春耀 邱蕙 黄鹏丞 林裕城 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第3期661-666,共6页
The optimization of micro milling electrical discharge machining(EDM) process parameters of Inconel 718 alloy to achieve multiple performance characteristics such as low electrode wear,high material removal rate and... The optimization of micro milling electrical discharge machining(EDM) process parameters of Inconel 718 alloy to achieve multiple performance characteristics such as low electrode wear,high material removal rate and low working gap was investigated by the Grey-Taguchi method.The influences of peak current,pulse on-time,pulse off-time and spark gap on electrode wear(EW),material removal rate(MRR) and working gap(WG) in the micro milling electrical discharge machining of Inconel 718 were analyzed.The experimental results show that the electrode wear decreases from 5.6×10-9 to 5.2×10-9 mm3/min,the material removal rate increases from 0.47×10-8 to 1.68×10-8 mm3/min,and the working gap decreases from 1.27 to 1.19 μm under optimal micro milling electrical discharge machining process parameters.Hence,it is clearly shown that multiple performance characteristics can be improved by using the Grey-Taguchi method. 展开更多
关键词 Inconel 718 alloy micro milling electrical discharge machining electrode wear material removal rate working gap Grey-Taguchi method
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Simulation and experimental investigation of inner-jet electrochemical grinding of GH4169 alloy 被引量:15
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作者 Hansong LI Shuxing FU +2 位作者 Qingliang ZHANG Shen NIU Ningsong QU 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2018年第3期608-616,共9页
GH4169 alloy is one of the most commonly used materials in aero engine turbine blades,but its machinability is poor because of its excellent strength at high temperatures. Electrochemical machining(ECM) has become a... GH4169 alloy is one of the most commonly used materials in aero engine turbine blades,but its machinability is poor because of its excellent strength at high temperatures. Electrochemical machining(ECM) has become a common method for machining this alloy and other difficult-tomachine materials. Electrochemical grinding(ECG) is a hybrid process combining ECM and conventional grinding. In this paper, investigations conducted on inner-jet ECG of GH4169 alloy are described. Two types of inner-jet ECG grinding wheels were used to machine a flat bottom surface.The machining process was simulated using COMSOL software, and machining gaps under different machining parameters were obtained. In addition, maximum feed rates and maximum material removal rates under different machining parameters were studied experimentally. The maximum sizes and the uniformity of the distributions of the gaps machined by the two grinding wheels were compared. The effects of different applied voltages on the machining results were also investigated. 展开更多
关键词 Electrochemical grinding GH4169 alloy Inner-jet material removal rate Maximum feed rate
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Material removal rate of 6H-SiC crystal substrate CMP using an alumina(Al_2O_3) abrasive 被引量:10
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作者 苏建修 杜家熙 +2 位作者 马利杰 张竹青 康仁科 《Journal of Semiconductors》 EI CAS CSCD 2012年第10期142-148,共7页
The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the p... The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the polishing pressure,on the material removal rate of SiC crystal substrate(0001) Si and a(0001) C surface have been studied based on the alumina abrasive in chemical mechanical polishing(CMP).The results proposed by our research here will provide a reference for developing the slurry,optimizing the process parameters,and investigating the material removal mechanism in the CMP of SiC crystal substrate. 展开更多
关键词 SiC crystal substrate alumina abrasive chemical mechanical polishing material removal rate polishing slurry
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Kinematics constrained five-axis tool path planning for high material removal rate 被引量:8
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作者 YE Tao XIONG CalHua +1 位作者 XIONG YouLun ZHAO Can 《Science China(Technological Sciences)》 SCIE EI CAS 2011年第12期3155-3165,共11页
Traditional five-axis tool path planning methods mostly focus on differential geometric characteristics between the cutter and the workpiece surface to increase the material removal rate(i.e.,by minimizing path length... Traditional five-axis tool path planning methods mostly focus on differential geometric characteristics between the cutter and the workpiece surface to increase the material removal rate(i.e.,by minimizing path length,improving curvature matching,maximizing local cutting width,etc.) . However,material removal rate is not only related to geometric conditions such as the local cutting width,but also constrained by feeding speed as well as the motion capacity of the five-axis machine. This research integrates machine tool kinematics and cutter-workpiece contact kinematics to present a general kinematical model for five-axis machining process. Major steps of the proposed method include:(1) to establish the forward kinematical relationship between the motion of the machine tool axes and the cutter contact point;(2) to establish a tool path optimization model for high material removal rate based on both differential geometrical property and the contact kinematics between the cutter and workpiece;(3) to convert cutter orientation and cutting direction optimization problem into a concave quadratic planning(QP) model. Tool path will finally be generated from the underlying optimal cutting direction field. Through solving the time-optimal trajectory generation problem and machining experiment,we demonstrate the validity and effectiveness of the proposed method. 展开更多
关键词 tool path material removal rate contact motion quadratic planning
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Experimental investigation of rotary sinking electrochemical discharge milling with high-conductivity salt solution and non-pulsed direct current 被引量:4
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作者 Xiaokang YUE Yuehong MA +1 位作者 Ningsong QU Hansong LI 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2023年第2期388-401,共14页
Electrochemical milling is a modified technique of traditional electrochemical machining(ECM)that can be used to manufacture some helicopter transmission system parts.The use of rotary tools and an inner-jet electroly... Electrochemical milling is a modified technique of traditional electrochemical machining(ECM)that can be used to manufacture some helicopter transmission system parts.The use of rotary tools and an inner-jet electrolyte supply pattern can greatly improve the material removal rate(MRR)in a single pass.However,the feed speed is generally limited to minimize the tool wear.To increase the MRR,electrical discharge machining(EDM)is introduced into the electrochemical milling process.The tool rotation is employed to interrupt the discharge and the high-conductivity salt solution and non-pulsed direct current power supply are also adopted to increase ECM,eventually,a new machining method is proposed,which can be called rotary sinking electrochemical discharge milling(RSECD milling).The mechanism of it is explored in this study by analyzing the machined current,MRR,surface morphology,and tool wear at different applied voltages and feed speeds.Besides,the RSECD milling using the tool with a larger diameter is also conducted to further verify the effectiveness.In particular,the MRR can be increased by 742.5%when using the tool with a diameter of 20 mm at the applied voltage of 20 V. 展开更多
关键词 Electrochemical discharge machining Electrochemical milling High-conductivity salt solution material removal rate Rotary tool
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Optimization of Polishing Parameters with Taguchi Method for LBO Crystal in CMP 被引量:4
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作者 Jun Li Yongwei Zhu +2 位作者 Dunwen Zuo Yong Zhu Chuangtian Chen 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2009年第5期703-707,共5页
Chemical mechanical polishing (CMP) was used to polish Lithium triborate (LiB3O5 or LBO) crystal. Taguchi method was applied for optimization of the polishing parameters. Material removal rate (MRR) and surface ... Chemical mechanical polishing (CMP) was used to polish Lithium triborate (LiB3O5 or LBO) crystal. Taguchi method was applied for optimization of the polishing parameters. Material removal rate (MRR) and surface roughness are considered as criteria for the optimization. The polishing pressure, the abrasive concentration and the table velocity are important parameters which influence MRR and surface roughness in CMP of LBO crystal. Experiment results indicate that for MRR the polishing pressure is the most significant polishing parameter followed by table velocity; while for the surface roughness, the abrasive concentration is the most important one. For high MRR in CMP of LBO ctystal the optimal conditions are: pressure 620 g/cm^2, concentration 5.0 wt pct, and velocity 60 r/min, respectively. For the best surface roughness the optimal conditions are: pressure 416 g/cm^2, concentration 5.0 wt pct, and velocity 40 r/min, respectively. The contributions of individual parameters for MRR and surface roughness were obtained. 展开更多
关键词 Chemical mechanical polishing (CMP) Lithium triborate (LBO) crystal material removal rate (MRR) Surface roughness Taguchi method
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Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire 被引量:4
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作者 Mufang ZHOU Min ZHONG Wenhu XU 《Friction》 SCIE EI CAS CSCD 2023年第11期2073-2090,共18页
Ultrasonic-assisted chemical mechanical polishing(UA-CMP)can greatly improve the sapphire material removal and surface quality,but its polishing mechanism is still unclear.This paper proposed a novel model of material... Ultrasonic-assisted chemical mechanical polishing(UA-CMP)can greatly improve the sapphire material removal and surface quality,but its polishing mechanism is still unclear.This paper proposed a novel model of material removal rate(MRR)to explore the mechanism of sapphire UA-CMP.It contains two modes,namely two-body wear and abrasive-impact.Furthermore,the atomic force microscopy(AFM)in-situ study,computational fluid dynamics(CFD)simulation,and polishing experiments were conducted to verify the model and reveal the polishing mechanism.In the AFM in-situ studies,the tip scratched the reaction layer on the sapphire surface.The pit with a 0.22 nm depth is the evidence of two-body wear.The CFD simulation showed that abrasives could be driven by the ultrasonic vibration to impact the sapphire surface at high frequencies.The maximum total velocity and the air volume fraction(AVF)in the central area increased from 0.26 to 0.55 m/s and 20%to 49%,respectively,with the rising amplitudes of 1–3μm.However,the maximum total velocity rose slightly from 0.33 to 0.42 m/s,and the AVF was nearly unchanged under 40–80 r/min.It indicated that the ultrasonic energy has great effects on the abrasive-impact mode.The UA-CMP experimental results exhibited that there was 63.7%improvement in MRR when the polishing velocities rose from 40 to 80 r/min.The roughness of the polished sapphire surface was R_(a)=0.07 nm.It identified that the higher speed achieved greater MRR mainly through the two-body wear mode.This study is beneficial to further understanding the UA-CMP mechanism and promoting the development of UA-CMP technology. 展开更多
关键词 SAPPHIRE ultrasonic-assisted chemical mechanical polishing(UA-CMP) material removal rate(MRR)predictive model atomic force microscopy(AFM)in-situ studies computational fluid dynamics(CFD)
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Improving energy utilization efficiency of electrical discharge milling in titanium alloys machining 被引量:3
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作者 郭成波 韦东波 狄士春 《Journal of Central South University》 SCIE EI CAS CSCD 2016年第10期2550-2557,共8页
Electrical discharge milling(ED-milling) can be a good choice for titanium alloys machining and it was proven that its machining efficiency can be improved to compete with mechanical cutting. In order to improve energ... Electrical discharge milling(ED-milling) can be a good choice for titanium alloys machining and it was proven that its machining efficiency can be improved to compete with mechanical cutting. In order to improve energy utilization efficiency of ED-milling process, unstable arc discharge and stable arc discharge combined with normal discharge were implemented for material removal by adjusting servo control strategy. The influence of electrode rotating speed and dielectric flushing pressure on machining performance was investigated by experiments. It was found that the rotating of electrode could move the position of discharge plasma channel, and high pressure flushing could wash melted debris out the discharge gap effectively. Both electrode rotating motion and high pressure flushing are contributed to the improvement of machining efficiency. 展开更多
关键词 electrical discharge milling electrode rotating dielectric flushing energy utilization efficiency material removal rate tool electrode wearing rate
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Material removal rate in chemical-mechanical polishing of wafers based on particle trajectories 被引量:3
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作者 苏建修 陈锡渠 +1 位作者 杜家熙 康仁科 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第5期145-150,共6页
Distribution forms of abrasives in the chemical mechanical polishing(CMP) process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed b... Distribution forms of abrasives in the chemical mechanical polishing(CMP) process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics.According to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are obtained.The analysis results are in accord with the experimental results.The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP. 展开更多
关键词 chemical mechanical polishing material removal mechanism ABRASIVE material removal rate
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Electrical discharge machining of 6061 aluminium alloy 被引量:2
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作者 A.PRAMANIK A.K.BASAK +1 位作者 M.N.ISLAM G.LITTLEFAIR 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第9期2866-2874,共9页
The wire electrical discharge machining(EDM) of 6061 aluminium alloy in terms of material removal rate,kerf/slit width,surface finish and wear of electrode wire for different pulse on time and wire tension was studi... The wire electrical discharge machining(EDM) of 6061 aluminium alloy in terms of material removal rate,kerf/slit width,surface finish and wear of electrode wire for different pulse on time and wire tension was studied.Eight experiments were carried out in a wire EDM machine by varying pulse on time and wire tension.It is found that the material removal rate increases with the increase of pulse on time though the wire tension does not affect the material removal rate.It seems that the higher wire tension facilitates steady machining process,which generates low wear in wire electrode and better surface finish.The surface roughness does not change notably with the variation of pulse on time.The appearance of the machined surfaces is very similar under all the machining conditions.The machined surface contains solidified molten material,splash of materials and blisters.The increase of the pulse on time increases the wear of wire electrode due to the increase of heat input.The wear of wire electrode generates tapered slot which has higher kerf width at top side than that at bottom side.The higher electrode wear introduces higher taper. 展开更多
关键词 wire electrical discharge machining(EDM) 6061 aluminium alloy material removal rate kerf width surface finish
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