In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore ...In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.展开更多
Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper ...Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.展开更多
Copper nanowires were synthesized by the wet chemical reduction method using copper sulfate as the copper precursor,aliphatic amines(methylamine,ethanediamine,1,2-propanediamine)as the inducing reagents,and hydrazine ...Copper nanowires were synthesized by the wet chemical reduction method using copper sulfate as the copper precursor,aliphatic amines(methylamine,ethanediamine,1,2-propanediamine)as the inducing reagents,and hydrazine hydrate as the reductant through the aging and reduction processes.The high-resolution transmission electron microscopy(HRTEM)images reveal that the copper nanowires were synthesized by coalescing extremely small-sized copper nanoparticles with the particle sizes of1–6 nm in copper complex micelles.A longer aging time period favored the coalescing of the copper nanoparticles to form thinner copper nanowires in the following reduction process.The coalescing extent of copper nanoparticles in copper nanowires was highly enhanced by ethanediamine and 1,2-propanediamine as compared with that by methylamine.The copper nanowire-filled polyester films had higher electrical conductivity than the copper nanoparticle-filled ones.展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
This paper showed simple and effective synthesis of copper nanoparticles within controlled diameter using direct electroless deposition on glass substrates, following the sensitization and activation steps. Electroles...This paper showed simple and effective synthesis of copper nanoparticles within controlled diameter using direct electroless deposition on glass substrates, following the sensitization and activation steps. Electroless-deposited metals, such as Cu, Co, Ni, and Ag, and their alloys had many advantages in micro- and nanotechnologies. The structural, morphological, and optical properties of copper deposits were characterized using X-ray diffraction （XRD）, atomic force microscopy （AFM）, and UV-Vis spectroscopy. The structural data was further analyzed using the Rietveld refinement program. Structural studies reveal that the deposited copper prefers a （111） orientation. AFM studies suggest the deposited materials form compact, uniform, and nanocrystalline phases with a high tendency to self-organize. The data show that the particle size can be controlled by controlling the activator concentration. The absorption spectra of the as-deposited copper nanoparticles reveal that the plasmonic peak broadens and exhibits a blue shift with decreasing particle size.展开更多
The present work uses PEO solution to well disperse carbon fiber and identifies percolation thresholds of carbon fiber and carbon black which are used as conductive fillers.The resultant cathode plates have an average...The present work uses PEO solution to well disperse carbon fiber and identifies percolation thresholds of carbon fiber and carbon black which are used as conductive fillers.The resultant cathode plates have an average compressive strength of 27.3 MPa and flexural strength of 29.09 MPa,which demonstrate excellent mechanical properties.The Cu^(2+)removal efficiency was measured at different current densities in EC process with cement-based cathode plate,while the voltage changes were recorded.The results showed that the cement-based cathode plate operated stably and achieved 99.7%removal of 1 L of simulated wastewater with a Cu^(2+)concentration of 200 ppm at a current density of 8 m A/cm^(2)for 1 h.Characterization of floc and tested cathode plates,SEM and EDS analyses,and repeatability testing of the tested plates demonstrate the reusability of the plates,proving that cement-based plates can effectively replace metal cathode plates,reduce the cost of EC and improve the applicability of EC devices.展开更多
文摘In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.
文摘Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.
基金financially supported by the fund from the Jiangsu Science and Technology Department,China(FZ20180919)。
文摘Copper nanowires were synthesized by the wet chemical reduction method using copper sulfate as the copper precursor,aliphatic amines(methylamine,ethanediamine,1,2-propanediamine)as the inducing reagents,and hydrazine hydrate as the reductant through the aging and reduction processes.The high-resolution transmission electron microscopy(HRTEM)images reveal that the copper nanowires were synthesized by coalescing extremely small-sized copper nanoparticles with the particle sizes of1–6 nm in copper complex micelles.A longer aging time period favored the coalescing of the copper nanoparticles to form thinner copper nanowires in the following reduction process.The coalescing extent of copper nanoparticles in copper nanowires was highly enhanced by ethanediamine and 1,2-propanediamine as compared with that by methylamine.The copper nanowire-filled polyester films had higher electrical conductivity than the copper nanoparticle-filled ones.
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
文摘This paper showed simple and effective synthesis of copper nanoparticles within controlled diameter using direct electroless deposition on glass substrates, following the sensitization and activation steps. Electroless-deposited metals, such as Cu, Co, Ni, and Ag, and their alloys had many advantages in micro- and nanotechnologies. The structural, morphological, and optical properties of copper deposits were characterized using X-ray diffraction （XRD）, atomic force microscopy （AFM）, and UV-Vis spectroscopy. The structural data was further analyzed using the Rietveld refinement program. Structural studies reveal that the deposited copper prefers a （111） orientation. AFM studies suggest the deposited materials form compact, uniform, and nanocrystalline phases with a high tendency to self-organize. The data show that the particle size can be controlled by controlling the activator concentration. The absorption spectra of the as-deposited copper nanoparticles reveal that the plasmonic peak broadens and exhibits a blue shift with decreasing particle size.
基金Funded by the National Natural Science Foundation of China (No.52078394)the Key Research and Development Program of Hubei Provincial (No.2020BAB081)。
文摘The present work uses PEO solution to well disperse carbon fiber and identifies percolation thresholds of carbon fiber and carbon black which are used as conductive fillers.The resultant cathode plates have an average compressive strength of 27.3 MPa and flexural strength of 29.09 MPa,which demonstrate excellent mechanical properties.The Cu^(2+)removal efficiency was measured at different current densities in EC process with cement-based cathode plate,while the voltage changes were recorded.The results showed that the cement-based cathode plate operated stably and achieved 99.7%removal of 1 L of simulated wastewater with a Cu^(2+)concentration of 200 ppm at a current density of 8 m A/cm^(2)for 1 h.Characterization of floc and tested cathode plates,SEM and EDS analyses,and repeatability testing of the tested plates demonstrate the reusability of the plates,proving that cement-based plates can effectively replace metal cathode plates,reduce the cost of EC and improve the applicability of EC devices.
