摘要
随着电子信息技术的发展,电子产品与设备不断轻薄化、小型化、集成化。作为电子元器件的载体,电路板设计和制造也朝着高密度互连、小孔化技术的方向快速发展,由此HDI(高密度互连)板和IC(集成电路)板应运而生。为了满足高密度、高集成化要求,盲孔电镀填孔技术逐渐成为成为业界研究的重要课题之一。盲孔填孔不仅可以做到垫内盲孔的焊接,而且还可以采用上下叠孔的方式,替代部分层次或全层次之间的通孔负责电气传输,改善产品散热性。盲孔填孔工艺要求填孔电镀后,盲孔需要被铜层完全填充,凹陷值(dimple值)尽量小,孔内无包心、空洞或裂缝等缺陷,从而保证电子产品的可靠性和稳定性。目前市面上所存在的盲孔填孔镀铜工艺,电镀面铜均较厚,增加了后续蚀刻难度不利于细线路的制作。本项目的开展,解决了孔金属制程中现有药水均匀性不好、面铜过厚等问题。
With the development of electronic information technology,electronic products and devices are constantly becoming thinner,smaller,and more integrated.As the carrier of electronic components,circuit board design and manufacturing are rapidly developing towards high-density interconnection and small hole technology,giving rise to HDI(high-density interconnection)boards and IC(integrated circuit)boards.In order to meet the requirements of high density and high integration,blind hole electroplating and filling technology has gradually become one of the important research topics in the industry.Blind hole filling can not only achieve welding of blind holes inside the pad,but also use the method of stacking holes on top and bottom to replace through holes between some or all layers for electrical transmission,improving product heat dissipation.The blind hole filling process requires that after the hole filling electroplating,the blind hole needs to be completely filled with a copper layer,with the dimple value as small as possible,and there should be no defects such as inclusions,voids,or cracks inside the hole,thereby ensuring the reliability and stability of electronic products.The blind hole filling copper plating process currently available on the market has a thick copper plating surface,which increases the difficulty of subsequent etching and is not conducive to the production of fine lines.The implementation of this project has solved the problems of poor uniformity of the existing solution and excessive copper thickness in the process of hole metal manufacturing.
作者
徐国兴
张基兴
吴彩昭
孙宇曦
曾庆明
Xu Guoxing;Zhang Jixing;Wu Caizhao;Sun Yuxi;Zeng Qingming
出处
《印制电路信息》
2025年第S1期148-153,共6页
Printed Circuit Information
关键词
电子信息新材料
电镀铜技术
超薄填孔
整平剂
Electronic Information New Materials
Copper Plating Technology
Ultra Thin Hole Filling
Levelers
