High-performance Ge n~＋/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal（nickel）-induced dopant activation technique. The obtained Ni Ge electroded Ge n＋/p junction has a...High-performance Ge n~＋/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal（nickel）-induced dopant activation technique. The obtained Ni Ge electroded Ge n＋/p junction has a rectification ratio of 5.6×10~4 and a forward current of 387 A/cm^2at -1 V bias. The Ni-based metal-induced dopant activation technique is expected to meet the requirement of the shallow junction of Ge MOSFET.展开更多
Ohmic cathode contact can be formed readily via coordination-activated n-doping(CAN),by co-evaporating air-stable metals(e.g.,silver)and organic ligands with coordination sites.It has been proposed that increasing the...Ohmic cathode contact can be formed readily via coordination-activated n-doping(CAN),by co-evaporating air-stable metals(e.g.,silver)and organic ligands with coordination sites.It has been proposed that increasing the nucleophilicity of the main binding site of a ligand is essential for reducing the work function of the doped films.展开更多
By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and mea...By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and measuring the sheet resistance of NiSi films（R_（NiSi））,we study the effects of different dopant segregation process parameters,including impurity implantation dose,segregation annealing temperature and segregation annealing time,on theφ_（B,eff） of NiSi/ n-Si SJDs and the resistance characteristic of NiSi films.In addition,the changing rules ofφ_（B,eff） and R_（NiSi） are discussed.展开更多
The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky...The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky junction diodes（NiSi/n-Si SJDs）,the effects of different of process parameters dopant segregation,including segregation anneal temperature and dopant implant dose,on the properties of the NiSi/n-Si SJDs have been studied,and the corresponding mechanisms are discussed.展开更多
The effect of periodic delta-doping and modulation-doping on high Al content n-AlxGa1-xN （x = 0.55） epilayers grown by MOCVD has been investigated. Measured by XRD, AFM, contactless sheet resistance, and Hall-effect...The effect of periodic delta-doping and modulation-doping on high Al content n-AlxGa1-xN （x = 0.55） epilayers grown by MOCVD has been investigated. Measured by XRD, AFM, contactless sheet resistance, and Hall-effect tests, 8-doped and modulation-doped n-Alx Ga1-xN have better crystal quality, surface morphology and electrical properties as compared with uniformly-doped n-AlxGa1-xN. These improvements are attributed to the SiNx growth mask induced by δ-doping layers and the dislocation-blocking effect induced by both growth techniques. In addition, due to the broadened doping profile ascribed to enhanced dopant diffusion at high growth temperatures （1150 ℃） ofn-Al0.55 Ga0.45N, modulation-doped n-Al0.55 Ga0.45N has similar properties as 8-doped n-Al0.55 Ga0.45N.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61176092 and 61474094)the National Natural Science Foundation of China–National Research Foundation of Korea Joint Research Project(Grant No.11311140251)the National Basic Research Program of China(Grant Nos.2012CB933503 and 2013CB632103)
文摘High-performance Ge n~＋/p junctions were fabricated at a low formation temperature from 325℃ to 400℃ with a metal（nickel）-induced dopant activation technique. The obtained Ni Ge electroded Ge n＋/p junction has a rectification ratio of 5.6×10~4 and a forward current of 387 A/cm^2at -1 V bias. The Ni-based metal-induced dopant activation technique is expected to meet the requirement of the shallow junction of Ge MOSFET.
基金supported by the National Key Basic Research and Development Program of China(grant no.2017YFA0204501)the National Science Fund of China(grant nos.U1601651,51903137,and 61890942)+2 种基金the Guangdong Major Project of Basic and Applied Basic Research(grant no.2019B030302009)the Foshan Xianhu Laboratory of the Advanced Energy Science and Technology Guangdong Laboratory(grant no.XHT2020-005)the Young Elite Scientist Sponsorship Program for the financial support(grant no.2019QNRC001)by the China Association for Science and Technology。
文摘Ohmic cathode contact can be formed readily via coordination-activated n-doping(CAN),by co-evaporating air-stable metals(e.g.,silver)and organic ligands with coordination sites.It has been proposed that increasing the nucleophilicity of the main binding site of a ligand is essential for reducing the work function of the doped films.
文摘By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and measuring the sheet resistance of NiSi films（R_（NiSi））,we study the effects of different dopant segregation process parameters,including impurity implantation dose,segregation annealing temperature and segregation annealing time,on theφ_（B,eff） of NiSi/ n-Si SJDs and the resistance characteristic of NiSi films.In addition,the changing rules ofφ_（B,eff） and R_（NiSi） are discussed.
文摘The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky junction diodes（NiSi/n-Si SJDs）,the effects of different of process parameters dopant segregation,including segregation anneal temperature and dopant implant dose,on the properties of the NiSi/n-Si SJDs have been studied,and the corresponding mechanisms are discussed.
基金supported by the National High Technology Research and Development Program of China(No.2011AA03 A 111)the National Natural Science Foundation of China(No.61006038)
文摘The effect of periodic delta-doping and modulation-doping on high Al content n-AlxGa1-xN （x = 0.55） epilayers grown by MOCVD has been investigated. Measured by XRD, AFM, contactless sheet resistance, and Hall-effect tests, 8-doped and modulation-doped n-Alx Ga1-xN have better crystal quality, surface morphology and electrical properties as compared with uniformly-doped n-AlxGa1-xN. These improvements are attributed to the SiNx growth mask induced by δ-doping layers and the dislocation-blocking effect induced by both growth techniques. In addition, due to the broadened doping profile ascribed to enhanced dopant diffusion at high growth temperatures （1150 ℃） ofn-Al0.55 Ga0.45N, modulation-doped n-Al0.55 Ga0.45N has similar properties as 8-doped n-Al0.55 Ga0.45N.
