The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/G...The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/GaN HEMTs. S-parameter measurements show that the frequency performance of the AIGaN/GaN HEMTs depends significantly on the operating voltage. Higher operating voltage is a key to higher power gain for the AIGaN/GaN HEMTs. The developed 2-stage power MMIC delivers an output power of more than 10W with over 12dB power gain across the band of 9-11GHz at a drain bias of 30V. Peak output power inside the band reaches 14.7W with a power gain of 13.7dB and a PAE of 23%. The MMIC chip size is only 2.0mm × 1. 1mm. This work shows superiority over previously reported X-band AIGaN/GaN HEMT power MMICs in output power per millimeter gate width and output power per unit chip size.展开更多
基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,...基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,改善了放大器芯片的温度分布特性。测试结果表明,在2.8~3.6 GHz测试频带内,在脉冲偏压28 V（脉宽100μs,占空比10%）时,峰值输出功率大于60W,功率附加效率大于45%,小信号增益大于34 d B,增益平坦度在±0.3 d B以内,输入电压驻波比在1.7以下;在稳态偏压28 V时,连续波饱和输出功率大于40 W,功率附加效率38%以上。该MMIC尺寸为4.2 mm×4.0 mm。展开更多
采用Ga As衬底增强/耗尽型赝配高电子迁移率晶体管（E/D PHEMT）工艺研制了一款6～10 GHz多功能微波单片集成电路（MMIC）。其集成了4个单刀双掷开关、6 bit数控移相器、6 bit数控衰减器、3个放大器和14 bit并口驱动电路。测试结果表明...采用Ga As衬底增强/耗尽型赝配高电子迁移率晶体管（E/D PHEMT）工艺研制了一款6～10 GHz多功能微波单片集成电路（MMIC）。其集成了4个单刀双掷开关、6 bit数控移相器、6 bit数控衰减器、3个放大器和14 bit并口驱动电路。测试结果表明：接收支路增益大于8 d B,1 d B压缩点输出功率大于3 d Bm;发射支路增益大于1 d B,1 d B压缩点输出功率大于8 d Bm。移相64态均方根误差小于3°,衰减64态均方根误差小于1 d B。在工作频带内接收和发射两种状态下,输入输出驻波比均小于1.5∶1。经过版图优化后,芯片尺寸为3.5 mm×5.1 mm。该多功能MMIC可用于微波收发组件,对传输信号进行幅相控制。展开更多
文摘The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/GaN HEMTs. S-parameter measurements show that the frequency performance of the AIGaN/GaN HEMTs depends significantly on the operating voltage. Higher operating voltage is a key to higher power gain for the AIGaN/GaN HEMTs. The developed 2-stage power MMIC delivers an output power of more than 10W with over 12dB power gain across the band of 9-11GHz at a drain bias of 30V. Peak output power inside the band reaches 14.7W with a power gain of 13.7dB and a PAE of 23%. The MMIC chip size is only 2.0mm × 1. 1mm. This work shows superiority over previously reported X-band AIGaN/GaN HEMT power MMICs in output power per millimeter gate width and output power per unit chip size.
文摘基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,改善了放大器芯片的温度分布特性。测试结果表明,在2.8~3.6 GHz测试频带内,在脉冲偏压28 V（脉宽100μs,占空比10%）时,峰值输出功率大于60W,功率附加效率大于45%,小信号增益大于34 d B,增益平坦度在±0.3 d B以内,输入电压驻波比在1.7以下;在稳态偏压28 V时,连续波饱和输出功率大于40 W,功率附加效率38%以上。该MMIC尺寸为4.2 mm×4.0 mm。
文摘采用Ga As衬底增强/耗尽型赝配高电子迁移率晶体管（E/D PHEMT）工艺研制了一款6～10 GHz多功能微波单片集成电路（MMIC）。其集成了4个单刀双掷开关、6 bit数控移相器、6 bit数控衰减器、3个放大器和14 bit并口驱动电路。测试结果表明：接收支路增益大于8 d B,1 d B压缩点输出功率大于3 d Bm;发射支路增益大于1 d B,1 d B压缩点输出功率大于8 d Bm。移相64态均方根误差小于3°,衰减64态均方根误差小于1 d B。在工作频带内接收和发射两种状态下,输入输出驻波比均小于1.5∶1。经过版图优化后,芯片尺寸为3.5 mm×5.1 mm。该多功能MMIC可用于微波收发组件,对传输信号进行幅相控制。
