The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,wh...The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.展开更多
通过利用 TEM研究 Si Cp/ Al- Si复合材料发现 :Si C/ Al界面结合紧密 ,在靠近 Si C界面的 Al基体中 ,有一层厚度小于 1μm的“亚晶铝带”,它紧靠 Si C表面形成 ,与远离 Si C的 Al基体有几度的位向差 ;这种“亚晶铝带”在 Si C/ Al界面...通过利用 TEM研究 Si Cp/ Al- Si复合材料发现 :Si C/ Al界面结合紧密 ,在靠近 Si C界面的 Al基体中 ,有一层厚度小于 1μm的“亚晶铝带”,它紧靠 Si C表面形成 ,与远离 Si C的 Al基体有几度的位向差 ;这种“亚晶铝带”在 Si C/ Al界面上普遍存在 ,其内有大量位错。展开更多
对利用原位反应与高剪切液态搅拌复合专利技术制备的Al3Ti TiB2SiC/Al13%Si复合材料的增强相的形成热力学进行了理论计算和分析,并采用差热分析法(DTA)进行了试验验证。研究表明:(1)Al Ti B体系加入到Al13%Si熔体中可发生原位反应,形成...对利用原位反应与高剪切液态搅拌复合专利技术制备的Al3Ti TiB2SiC/Al13%Si复合材料的增强相的形成热力学进行了理论计算和分析,并采用差热分析法(DTA)进行了试验验证。研究表明:(1)Al Ti B体系加入到Al13%Si熔体中可发生原位反应,形成增强相,原位反应的开始温度为905.3℃,结束温度为1061.23℃;(2)Al Ti B体系加入到Al13%Si熔体中,制备颗粒增强Al13%Si复合材料的增强相为TiB2和Al3Ti,但TiB2形成能力最强。展开更多
基金Project (60776019) supported by the National Natural Science Foundation of ChinaProject (61-TP-2010) supported by the Research Fund of the State Key Laboratory of Solidification Processing (NWPU),China
文摘The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.
文摘对利用原位反应与高剪切液态搅拌复合专利技术制备的Al3Ti TiB2SiC/Al13%Si复合材料的增强相的形成热力学进行了理论计算和分析,并采用差热分析法(DTA)进行了试验验证。研究表明:(1)Al Ti B体系加入到Al13%Si熔体中可发生原位反应,形成增强相,原位反应的开始温度为905.3℃,结束温度为1061.23℃;(2)Al Ti B体系加入到Al13%Si熔体中,制备颗粒增强Al13%Si复合材料的增强相为TiB2和Al3Ti,但TiB2形成能力最强。
