Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investiga...Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investigated.The results revealed that a uniform Al/Cu interface with excellent bonding quality was achieved.The thickness of intermetallic compounds(IMCs)reached 33.88μm after sintering at 620℃for 2 h,whereas it was only 14.88μm when sintered at 600℃for 1 h.AlCu phase was developed through the reaction between Al4Cu9 and Al2Cu with prolonging sintering time,and an amorphous oxide strip formed at AlCu/Al4Cu9 interface.Both the grain morphology and interfacial structure affected the tensile strength of Al/Cu laminate,whereas the mode of tensile fracture strongly relied on the interfacial bonding strength.The highest tensile strength of 151.1 MPa and bonding strength of 93.7 MPa were achieved after sintering at 600℃for 1 h.展开更多
The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted...The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.展开更多
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu...A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.展开更多
A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu ...A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.展开更多
基金the financial support from the National Natural Science Foundation of China(Nos.51875317,52222510)Key Research and Development Program of Shandong Province,China(No.2021ZLGX01)。
文摘Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investigated.The results revealed that a uniform Al/Cu interface with excellent bonding quality was achieved.The thickness of intermetallic compounds(IMCs)reached 33.88μm after sintering at 620℃for 2 h,whereas it was only 14.88μm when sintered at 600℃for 1 h.AlCu phase was developed through the reaction between Al4Cu9 and Al2Cu with prolonging sintering time,and an amorphous oxide strip formed at AlCu/Al4Cu9 interface.Both the grain morphology and interfacial structure affected the tensile strength of Al/Cu laminate,whereas the mode of tensile fracture strongly relied on the interfacial bonding strength.The highest tensile strength of 151.1 MPa and bonding strength of 93.7 MPa were achieved after sintering at 600℃for 1 h.
基金Projects(50971038,51174058)supported by the National Natural Science Foundation of China
文摘The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.
基金Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of ChinaProjects (2013M530913) supported by the China Postdoctoral Science Foundation
文摘A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.
基金Project(51571080)supported by the National Natural Science Foundation of China
文摘A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.
