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累积叠轧和电沉积工艺制备Al/Cu复合材料及其组织和力学性能研究

Study on Microstructure and Mechanical Properties of Al/Cu Composites Prepared by Accumulative Roll Bonding and Electrodeposition Process
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摘要 采用累积叠轧(ARB)和电沉积工艺制备了Al/Cu复合板,重点研究沉积铜层厚度以及Al/Cu复合板组织性能变化。结果表明:电沉积所得铜层厚度较为均匀且与铝板表面结合质量较好。随着累积叠轧道次的增加,界面结合质量越来越好,复合板中铜层逐渐颈缩或破碎,最后变成尺寸较小且分布较均匀的铜颗粒。4道次复合板抗拉强度最高,达到186.6 MPa,是退火态1060铝板抗拉强度的2.72倍。 Al/Cu composite sheet was fabricated using accumulative roll bonding(ARB)and electrodeposition.The thickness of the deposited copper layer and the microstructure and mechanical properties of the composite sheet were investigated.The results show that the thickness of the copper layer obtained by electrodeposition is relatively uniform and the bonding quality with the surface of the aluminum sheet is better.With the increase of ARB cycles,the interface bonding quality is getting better and better,and the copper layer in the composite sheet gradually shrinks or breaks,and finally becomes smaller and more uniformly distributed copper particles.The composite after four ARB cycles reaches the highest ultimate tensile strength(UTS)of 186.6 MPa,which is 2.72 times of that of annealed 1060 aluminum sheet.
作者 冯佰刚 张晓波 FENG Baigang;ZHANG Xiaobo(State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou University of Technology,Lanzhou 730050,China;Department of Materials Science and Engineering,Lanzhou University of Technology,Lanzhou 730050,China)
出处 《热加工工艺》 北大核心 2025年第4期100-104,共5页 Hot Working Technology
基金 国家自然科学基金项目(51601084)。
关键词 累积叠轧(ARB) 电沉积 Al/Cu复合板 组织 力学性能 accumulative roll bonding(ARB) electrodeposition Al/Cu composite sheet microstructure mechanical properties
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