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Atomic surface of diamond induced by novel green photocatalytic chemical mechanical polishing with high material removal rate
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作者 Zhibin Yu Zhenyu Zhang +6 位作者 Zinuo Zeng Cheng Fan Yang Gu Chunjing Shi Hongxiu Zhou Fanning Meng Junyuan Feng 《International Journal of Extreme Manufacturing》 2025年第2期661-676,共16页
Atomic surfaces are strictly required by high-performance devices of diamond.Nevertheless,diamond is the hardest material in nature,leading to the low material removal rate(MRR)and high surface roughness during machin... Atomic surfaces are strictly required by high-performance devices of diamond.Nevertheless,diamond is the hardest material in nature,leading to the low material removal rate(MRR)and high surface roughness during machining.Noxious slurries are widely used in conventional chemical mechanical polishing(CMP),resulting in the possible pollution to the environment.Moreover,the traditional slurries normally contain more than four ingredients,causing difficulties to control the process and quality of CMP.To solve these challenges,a novel green CMP for single crystal diamond was developed,consisting of only hydrogen peroxide,diamond abrasive and Prussian blue(PB)/titania catalyst.After CMP,atomic surface is achieved with surface roughness Sa of 0.079 nm,and the MRR is 1168 nm·h^(-1).Thickness of damaged layer is merely 0.66 nm confirmed by transmission electron microscopy(TEM).X-ray photoelectron spectroscopy,electron paramagnetic resonance and TEM reveal that·OH radicals form under ultraviolet irradiation on PB/titania catalyst.The·OH radicals oxidize diamond,transforming it from monocrystalline to amorphous atomic structure,generating a soft amorphous layer.This contributes the high MRR and formation of atomic surface on diamond.The developed novel green CMP offers new insights to achieve atomic surface of diamond for potential use in their high-performance devices. 展开更多
关键词 photocatalytic chemical mechanical polishing DIAMOND photocatalytic Fenton reaction material removal rate atomic diamond surface
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Approach to estimating non-point pollutant load removal rates based on water environmental capacity: a case study in Shenzhen 被引量:1
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作者 刘梁 刘安 管运涛 《Journal of Southeast University(English Edition)》 EI CAS 2014年第2期143-149,共7页
An innovative approach based on water environmental capacity for non-point source NPS pollution removal rate estimation was discussed by using both univariate and multivariate data analysis.Taking Shenzhen city as the... An innovative approach based on water environmental capacity for non-point source NPS pollution removal rate estimation was discussed by using both univariate and multivariate data analysis.Taking Shenzhen city as the study case a 67% to 74% NPS pollutant load removal rate can lead to meeting the chemical oxygen demand COD pollution control target for most watersheds.In contrast it is hardly to achieve the ammonia nitrogen NH4-N total phosphorus TP and biological oxygen demand BOD5 pollution control target by simply removing NPS pollutants. This highlights that the pollution control strategies should be taken according to different pollutant species and sources in different watersheds rather than one-size-fits-all . 展开更多
关键词 environmental capacity estimation non-point source (NPS) pollution removal rate control strategy
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IMPROVING MATERIAL REMOVAL RATE OF BRITTLE CERAMICS THROUGH HONING INCIDENTAL TENSILE STRESSES
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作者 于爱兵 徐燕申 +1 位作者 林彬 王龙山 《Transactions of Tianjin University》 EI CAS 1998年第2期41-44,共4页
The stress intensity factors and stress conditions of machining cracks are analyzed by fracture mechanics on the basis of honing characteristics and of brittle ceramic mechanical behavior.Because the honing incidental... The stress intensity factors and stress conditions of machining cracks are analyzed by fracture mechanics on the basis of honing characteristics and of brittle ceramic mechanical behavior.Because the honing incidental tensile stresses effectively decrease the critical grinding stresses and increase the stress intensity factors of machining cracks,the honing process can be carried out easily.The results show that honing can be an efficient machining method for brittle materials. 展开更多
关键词 CERAMICS HONING incidental tensile stress material removal rate
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On investigating the soda-lime shot blasting of AZ31 alloy:Effects on surface roughness,material removal rate,corrosion resistance,and bioactivity 被引量:2
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作者 Gurmider Singh Sunpreet Singh +1 位作者 Chander Prakash Seeram Ramakrishna 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2021年第4期1278-1290,共13页
In the present study,a novel method of surface finish improvement is proposed using shot blasting of soda lime(SBSL)beads on the Mg-AZ31 alloy.The effect of the soda blasting process parameters,such as blast pressure,... In the present study,a novel method of surface finish improvement is proposed using shot blasting of soda lime(SBSL)beads on the Mg-AZ31 alloy.The effect of the soda blasting process parameters,such as blast pressure,stand-off distance,and blast duration,have been studied in-response of material removal rate(MRR)and surface roughness(SR)and corresponding statistical models have been obtained.The multi-objective optimization has also been performed to obtain parameters for maximum MRR and minimum SR.The corrosion behavior of the treated specimens has been performed to study their in-vitro biodegradability in simulated body fluid(SBF)for 1,3,7,10,15,and 21 days.The wettability study of the SBSL treated samples has been investigated using sessile drop methodology.Further,cell adhesion test has also been performed to study the biocompatibility characteristics of the SBSL treated samples using Huh7 liver cell lines.Based on obtained quantitative data as well as scanning electron microscopy analysis of treated samples,the SBSL treatment of the AZ31 alloy has been found highly useful in producing biocompatibility surfaces along with desirable morphological features. 展开更多
关键词 AZ31 Soda-lime Surface roughness Material removal rate Corrosion WETTABILITY BIOCOMPATIBILITY
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Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers 被引量:1
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作者 LI Yan JIE Wanqi +1 位作者 KANG Renke GAO Hang 《Rare Metals》 SCIE EI CAS CSCD 2011年第4期381-386,共6页
The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a... The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a peak of frictional coefficient at the early stage of scratch, and increasing the vertical force will result in the increase of peak value correspondingly. The fluctuation phenomenon of frictional coefficient is generated at high vertical force. The lateral forces show the apparent twofold and threefold symmetries on (110) and (111) planes, respectively. To obtain high surface quality, low polishing pressure and hard direction (〈 T10 〉 directions on (110) plane and 〈 112 〉 directions on (111) plane) should be selected, and to achieve high material removal rate, high polishing pressure and soft direction (〈001〉 directions on (110) plane and 〈 121 〉 directions on (111) plane) should be selected. 展开更多
关键词 cadmium compounds single crystals nanoscratch tests frictional coefficient material removal rate surface quality ANISOTROPY
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Removal Rate of Phosphorus by Different Constructed Wetland Substrates 被引量:1
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作者 LIU Yang 《Meteorological and Environmental Research》 2012年第3期61-64,共4页
[ Objective] The study aimed to discuss the removal rate of phosphorus by different constructed wetland substrates. [ Methed] Based on static experiments, we analyzed the removal rate and characteristics of phosphorus... [ Objective] The study aimed to discuss the removal rate of phosphorus by different constructed wetland substrates. [ Methed] Based on static experiments, we analyzed the removal rate and characteristics of phosphorus by different constructed wetland substrates like steel slag, cin- der slag, shale, boiler slag, soil and gravel. [ Result~ The maximum adsorption of phosphorus by various substrates showed as follows, steel slag 〉 cinder slag 〉 shale 〉 boiler slag 〉 soil 〉 gravel. When the initial concentration of phosphorus was 5 mg/L, the removal rate of phosphorus by the steel slag, cinder slag, shale, boiler slag, soil and gravel was 99.76%, 85.8%, 71.2%, 63.0%, 46.8% and 11.7% respectively. It is suggested that shale and boiler slag can be used as the substrate of subsurface-flow constructed wetlands; cinder slag can be chosen as a renewable sub- strate for intensifying phosphorus removal; steel slag could be used at the end of subsurface-flow constructed wetlands for treating TP in outflows. [Concluslon] The research could provide theoretical references for choosing a suitable substrate for constructed wetlands to remove phosphorus in future. 展开更多
关键词 Constructed wetland SUBSTrate removal rate of phosphorus Steel slag China
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Material Removal Rate Prediction of Electrical Discharge Machining Process Using Artificial Neural Network
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作者 Azli Yahya Trias Andromeda Ameruddin Baharom Arif Abd Rahim Nazriah Mahmud 《Journal of Mechanics Engineering and Automation》 2011年第4期298-302,共5页
This article presents an Artificial Neural Network (ANN) architecture to model the Electrical Discharge Machining (EDM) process. It is aimed to develop the ANN model using an input-output pattern of raw data colle... This article presents an Artificial Neural Network (ANN) architecture to model the Electrical Discharge Machining (EDM) process. It is aimed to develop the ANN model using an input-output pattern of raw data collected from an experimental of EDM process, whereas several research objectives have been outlined such as experimenting machining material for selected gap current, identifying machining parameters for ANN variables and selecting appropriate size of data selection. The experimental data (input variables) of copper-electrode and steel-workpiece is based on a selected gap current where pulse on time, pulse off time and sparking frequency have been chosen at optimum value of Material Removal Rate (MRR). In this paper, the result has significantly demonstrated that the ANN model is capable of predicting the MRR with low percentage prediction error when compared with the experimental result. 展开更多
关键词 Electrical discharge machining artificial neural network material removal rate.
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A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure
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作者 Shuangchen ZHAO Yebing TIAN +1 位作者 Shuang LIU Pengzhan WANG 《Frontiers of Mechanical Engineering》 2025年第3期171-186,共16页
A material removal mechanism is a prerequisite to maintaining high-quality surfaces for high-shear and low-pressure grinding using body-armor-like grinding wheels(BAGWs).However,the pressure distribution and material ... A material removal mechanism is a prerequisite to maintaining high-quality surfaces for high-shear and low-pressure grinding using body-armor-like grinding wheels(BAGWs).However,the pressure distribution and material removal efficiency for machining brittle materials using BAGWs remain unclear.This research investigated two types of elastic deformations during grinding by analyzing the contact mechanism between BAGWs and the workpiece.Additionally,the model of elastohydrodynamic pressure distribution was refined,and the material removal mechanism for machining brittle materials,incorporating the maximum undeformed chip thickness,was revealed.A material removal rate(MRR)model was established based on Hertzian contact,ductile-brittle transition,and spherical indentation theory.The theoretical model was validated through single-factor experiments utilizing a high-shear and low-pressure grinding experimental platform.At a normal grinding force of 15 N and a grinding speed of 10 m/s,the MRR could reach up to 0.276 mm3/s.The experimental results revealed that the model could accurately predict the MRR under various grinding parameters,with an average prediction error of 8.5%. 展开更多
关键词 elastohydrodynamic pressure brittle-ductile transition material removal rate body-armor-like grinding wheel high-shear and low-pressure grinding
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Material removal rate of 6H-SiC crystal substrate CMP using an alumina(Al_2O_3) abrasive 被引量:9
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作者 苏建修 杜家熙 +2 位作者 马利杰 张竹青 康仁科 《Journal of Semiconductors》 EI CAS CSCD 2012年第10期142-148,共7页
The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the p... The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the polishing pressure,on the material removal rate of SiC crystal substrate(0001) Si and a(0001) C surface have been studied based on the alumina abrasive in chemical mechanical polishing(CMP).The results proposed by our research here will provide a reference for developing the slurry,optimizing the process parameters,and investigating the material removal mechanism in the CMP of SiC crystal substrate. 展开更多
关键词 SiC crystal substrate alumina abrasive chemical mechanical polishing material removal rate polishing slurry
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Kinematics constrained five-axis tool path planning for high material removal rate 被引量:8
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作者 YE Tao XIONG CalHua +1 位作者 XIONG YouLun ZHAO Can 《Science China(Technological Sciences)》 SCIE EI CAS 2011年第12期3155-3165,共11页
Traditional five-axis tool path planning methods mostly focus on differential geometric characteristics between the cutter and the workpiece surface to increase the material removal rate(i.e.,by minimizing path length... Traditional five-axis tool path planning methods mostly focus on differential geometric characteristics between the cutter and the workpiece surface to increase the material removal rate(i.e.,by minimizing path length,improving curvature matching,maximizing local cutting width,etc.) . However,material removal rate is not only related to geometric conditions such as the local cutting width,but also constrained by feeding speed as well as the motion capacity of the five-axis machine. This research integrates machine tool kinematics and cutter-workpiece contact kinematics to present a general kinematical model for five-axis machining process. Major steps of the proposed method include:(1) to establish the forward kinematical relationship between the motion of the machine tool axes and the cutter contact point;(2) to establish a tool path optimization model for high material removal rate based on both differential geometrical property and the contact kinematics between the cutter and workpiece;(3) to convert cutter orientation and cutting direction optimization problem into a concave quadratic planning(QP) model. Tool path will finally be generated from the underlying optimal cutting direction field. Through solving the time-optimal trajectory generation problem and machining experiment,we demonstrate the validity and effectiveness of the proposed method. 展开更多
关键词 tool path material removal rate contact motion quadratic planning
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Material removal rate in chemical-mechanical polishing of wafers based on particle trajectories 被引量:3
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作者 苏建修 陈锡渠 +1 位作者 杜家熙 康仁科 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第5期145-150,共6页
Distribution forms of abrasives in the chemical mechanical polishing(CMP) process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed b... Distribution forms of abrasives in the chemical mechanical polishing(CMP) process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics.According to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are obtained.The analysis results are in accord with the experimental results.The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP. 展开更多
关键词 chemical mechanical polishing material removal mechanism ABRASIVE material removal rate
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Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire 被引量:3
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作者 Mufang ZHOU Min ZHONG Wenhu XU 《Friction》 SCIE EI CAS CSCD 2023年第11期2073-2090,共18页
Ultrasonic-assisted chemical mechanical polishing(UA-CMP)can greatly improve the sapphire material removal and surface quality,but its polishing mechanism is still unclear.This paper proposed a novel model of material... Ultrasonic-assisted chemical mechanical polishing(UA-CMP)can greatly improve the sapphire material removal and surface quality,but its polishing mechanism is still unclear.This paper proposed a novel model of material removal rate(MRR)to explore the mechanism of sapphire UA-CMP.It contains two modes,namely two-body wear and abrasive-impact.Furthermore,the atomic force microscopy(AFM)in-situ study,computational fluid dynamics(CFD)simulation,and polishing experiments were conducted to verify the model and reveal the polishing mechanism.In the AFM in-situ studies,the tip scratched the reaction layer on the sapphire surface.The pit with a 0.22 nm depth is the evidence of two-body wear.The CFD simulation showed that abrasives could be driven by the ultrasonic vibration to impact the sapphire surface at high frequencies.The maximum total velocity and the air volume fraction(AVF)in the central area increased from 0.26 to 0.55 m/s and 20%to 49%,respectively,with the rising amplitudes of 1–3μm.However,the maximum total velocity rose slightly from 0.33 to 0.42 m/s,and the AVF was nearly unchanged under 40–80 r/min.It indicated that the ultrasonic energy has great effects on the abrasive-impact mode.The UA-CMP experimental results exhibited that there was 63.7%improvement in MRR when the polishing velocities rose from 40 to 80 r/min.The roughness of the polished sapphire surface was R_(a)=0.07 nm.It identified that the higher speed achieved greater MRR mainly through the two-body wear mode.This study is beneficial to further understanding the UA-CMP mechanism and promoting the development of UA-CMP technology. 展开更多
关键词 SAPPHIRE ultrasonic-assisted chemical mechanical polishing(UA-CMP) material removal rate(MRR)predictive model atomic force microscopy(AFM)in-situ studies computational fluid dynamics(CFD)
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Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP
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作者 王彩玲 康仁科 +1 位作者 金洙吉 郭东明 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第12期134-137,共4页
Based on the Preston equation, the mathematical model of the material removal rate (MRR), aiming at a line-orbit chemical mechanical polisher, is established. The MRR and the material removal non-uniformity (MRNU)... Based on the Preston equation, the mathematical model of the material removal rate (MRR), aiming at a line-orbit chemical mechanical polisher, is established. The MRR and the material removal non-uniformity (MRNU) are numerically calculated by MATLAB, and the effects of the reciprocating parameters on the MRR and the MRNU are discussed. It is shown that the smaller the inclination angle and the larger the amplitude, the higher the MRR and the lower the MRNU. The reciprocating speed of the carrier plays a minor role to improve the MRR and decrease the MRNU. The results provide a guide for the design of a polisher and the determination of a process in line-orbit chemical mechanical polishing. 展开更多
关键词 chemical mechanical polishing reciprocating parameters material removal rate material removal non-uniformity
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The optimization of FA/O barrier slurry with respect to removal rate selectivity on patterned Cu wafers
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作者 胡轶 李炎 +1 位作者 刘玉岭 何彦刚 《Journal of Semiconductors》 EI CAS CSCD 2016年第2期160-164,共5页
Because the polishing of different materials is required in barrier chemical mechanical planariza- tion (CMP) processes, the development of a kind of barrier slurry with improved removal rate selectivity for Cu/barr... Because the polishing of different materials is required in barrier chemical mechanical planariza- tion (CMP) processes, the development of a kind of barrier slurry with improved removal rate selectivity for Cu/barrier/TEOS would reduce erosion and dishing defects on patterned Cu wafers. In this study, we developed a new benzotriazole-free barrier slurry named FA/O barrier slurry, containing 20 mL/L of the chelating agent FA/O, 5 mL/L surfactant, and a 1:5 concentration of abrasive particles. By controlling the polishing slurry ingredients, the removal rate of different materials could be controlled. For process integration considerations, the effect of the FA/O barrier slurry on the dielectric layer of the patterned Cu wafer was investigated. After CMP processing by the FA/O barrier slurry, the characteristics of the dielectric material were tested. The results showed that the dielectric characteristics met demands for industrial production. The current leakage was of pA scale. The resistance and capacitance were 2.4 k and 2.3 pF, respectively. The dishing and erosion defects were both below 30 nm in size. CMP-processed wafers using this barrier slurry could meet industrial production demands. 展开更多
关键词 FA/O alkaline barrier slurry chemical mechanical planarization selectivity of removal rate dielectricmaterial characterization
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Response surface optimization of process parameters for removal of F and Cl from zinc oxide fume by microwave roasting 被引量:4
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作者 李志强 李静 +4 位作者 张利波 彭金辉 王仕兴 马爱元 王宝宝 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第3期973-980,共8页
Microwave was applied to roasting the zinc oxide fume obtained from fuming furnace for the removal of F and Cl. The effects of important parameters, such as roasting temperature, holding time and stirring speed, were ... Microwave was applied to roasting the zinc oxide fume obtained from fuming furnace for the removal of F and Cl. The effects of important parameters, such as roasting temperature, holding time and stirring speed, were investigated and the process conditions were optimized using response surface methodology (RSM). The results show that the effects of roasting temperature and holding time on the removal rate of F and Cl are the most significant, and the effect of stirring speed is the second. The defluorination rate reaches 92.6% while the dechlorination rate reaches 90.2%, under the process conditions of roasting temperature of 700 °C, holding time of 80 min and stirring speed of 120 r/min. The results indicate that the removal of F and Cl from fuming furnace production of zinc oxide fumes using microwave roasting process is feasible and reliable. 展开更多
关键词 zinc oxide fume F CL removal rate microwave roasting response surface methodology
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Optimization of Protein Removal Method and Condition of Polysaccharide from Phellinus Linteus 被引量:11
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作者 谢丽源 彭卫红 甘炳成 《Agricultural Science & Technology》 CAS 2011年第9期1249-1251,共3页
[Objective] The research aimed at optimizing protein removal method and condition of polysaccharide extracts from Phellinus Linteus and comparing the effects of two methods on protein removal.[Method] Free proteins in... [Objective] The research aimed at optimizing protein removal method and condition of polysaccharide extracts from Phellinus Linteus and comparing the effects of two methods on protein removal.[Method] Free proteins in polysaccharide from Phellinus Linteus were removed using Sevag method and TCA method.[Result] The TCA method was better than Sevag method,and the optimum protein removal condition was treated with 5% TCA for 30 min and for three times,under that condition,the protein removal rate attained 82% while the polysaccharide loss rate was only 10.8%.[Conclusion] The TCA method was a better way to remove proteins of polysaccharide from Phellinus Linteus. 展开更多
关键词 Phellinus linteus Sevag method TCA method POLYSACCHARIDE Protein removal rate Polysaccharide loss rate
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Multi-objective parameter optimization of abrasive water jet polishing for fused silica
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作者 LI Qian YAO Peng +6 位作者 DENG Hong-xing FENG Chen-yu XU Chong-hai QU Shuo-shuo YANG Yu-ying ZHU Hong-tao HUANG Chuan-zhen 《中国光学(中英文)》 北大核心 2025年第5期1185-1199,共15页
As a non-contact ultra-precision machining method,abrasive water jet polishing(AWJP)has signi-ficant application in optical elements processing due to its stable tool influence function(TIF),no subsurface damage and s... As a non-contact ultra-precision machining method,abrasive water jet polishing(AWJP)has signi-ficant application in optical elements processing due to its stable tool influence function(TIF),no subsurface damage and strong adaptability to workpiece shapes.In this study,the effects of jet pressure,nozzle diameter and impinging angle on the distribution of pressure,velocity and wall shear stress in the polishing flow field were systematically analyzed by computational fluid dynamics(CFD)simulation.Based on the Box-Behnken experimental design,a response surface regression model was constructed to investigate the influence mech-anism of process parameters on material removal rate(MRR)and surface roughness(Ra)of fused silica.And experimental results showed that increasing jet pressure and nozzle diameter significantly improved MRR,consistent with shear stress distribution revealed by CFD simulations.However,increasing jet pressure and impinging angle caused higher Ra values,which was unfavorable for surface quality improvement.Genetic algorithm(GA)was used for multi-objective optimization to establish Pareto solutions,achieving concurrent optimization of polishing efficiency and surface quality.A parameter combination of 2 MPa jet pressure,0.3 mm nozzle diameter,and 30°impinging angle achieved MRR of 169.05μm^(3)/s and Ra of 0.50 nm.Exper-imental verification showed prediction errors of 4.4%(MRR)and 3.8%(Ra),confirming the model’s reliabil-ity.This parameter optimization system provides theoretical basis and technical support for ultra-precision polishing of complex curved optical components. 展开更多
关键词 ABRASIVE computational fluid dynamics tool influence function material removal rate surface roughness
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Effectiveness of various chemical leaching systems in the remediation of chromium-contaminated soil and their impact on chromium speciation
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作者 Yuxiao Jiang Chao Hu +3 位作者 Aoyu Zhou Huiyang Qiu Benyi Cao Jian Xu 《Journal of Environmental Sciences》 2025年第11期77-89,共13页
Chemical leaching techniques have been proven effective in removing heavymetal contaminants fromsoil using various leaching agents.Previous research has shown that both singleagent and composite leaching systems have ... Chemical leaching techniques have been proven effective in removing heavymetal contaminants fromsoil using various leaching agents.Previous research has shown that both singleagent and composite leaching systems have been applied for the remediation of chromiumcontaminated soils,with varying degrees of success depending on soil type and contaminant form.However,the removal rate of total chromium(Cr)and hexavalent chromium(Cr(Ⅵ))often fluctuates based on the chemical composition of the leaching agents,as well as the soil’s physicochemical properties,such as pH and Cr speciation stability.Therefore,this study investigates the effectiveness of 20 composite leaching systems,including deionized water,lime water,calcium chloride,sodium carbonate,and sodium phosphate,through soil column leaching tests.The aim was to evaluate their impact on soil pH,total Cr,and Cr(Ⅵ)removal,and to examine the transformation of various Cr species during the leaching process.Results reveal that lime water and sodium phosphate were particularly effective in stabilizing Cr(Ⅵ)and neutralizing soil pH,while total Cr removal amount ranged from 197.4 mg/kg to 1671.6 mg/kg and Cr(Ⅵ)removal amount ranged from 113.2mg/kg to 316.8mg/kg.We also find that using 0.2 mol/L citric acid,0.1 mol/L hydrochloric acid,and 1.2 mL/g lime solution adjusted soil pH to 7.37,with average removal efficiencies of 34.6%.for total Cr and 72.7%for Cr(Ⅵ).Overall,our results suggest that the combined use of lime water and sodium phosphate is an effective strategy for remediating chromium-contaminated soil,particularly for stabilizing unleached Cr and adjusting soil pH. 展开更多
关键词 Chemical leaching techniques Metal contaminants REMEDIATION removal rate Total chromium Leaching systems
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Experimental Study on the Treatment of Flue Gas Desulfurization Wastewater by a Biological Fluidized Bed
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作者 Youchen LI Jingfu FAN Lina LI 《Meteorological and Environmental Research》 2025年第2期49-52,共4页
For the treatment of the mixed flue gas desulfurization wastewater with high salinity by the biological fluidized bed process,the optimum temperature was 25-35℃,and the optimum hydraulic retention time was 10 h.When ... For the treatment of the mixed flue gas desulfurization wastewater with high salinity by the biological fluidized bed process,the optimum temperature was 25-35℃,and the optimum hydraulic retention time was 10 h.When the influent quality was stable,the average concentration of COD,NH_(4)^(+)-N and TN in the inlet water was 210,11 and 16.3 mg/L,respectively,and their average concentration in the effluent was 54,0.32 and 4.09 mg/L,respectively.The treatment effect was good.When the incoming water quality of flue gas desulfurization wastewater fluctuated greatly,the effluent quality was still relatively stable after being treated by the biological fluidized bed,indicating that the biological fluidized bed process had a good ability to resist the impact of water quality in the treatment of high-salinity flue gas desulfurization wastewater.At the same time,the biological fluidized bed process provides a reference for high-salinity wastewater that is difficult to be biologically treated. 展开更多
关键词 Biological fluidized bed Flue gas desulfurization wastewater Average removal rate
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Potentialities of Maize on the Removal of Organochlorine Pesticides from Contaminated Soils 被引量:4
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作者 张福金 张欣昕 +3 位作者 侯德坤 连海飞 莎娜 刘秀萍 《Agricultural Science & Technology》 CAS 2014年第12期2127-2134,2191,共9页
In this paper, glasshouse experiments were conducted to determine the accumulation, distribution and transformation of DDTs and HCHs by maize under pot culture conditions. The culture soil was spiked with the organic ... In this paper, glasshouse experiments were conducted to determine the accumulation, distribution and transformation of DDTs and HCHs by maize under pot culture conditions. The culture soil was spiked with the organic pollutants and samples were collected in different durations. Analysis of the plants at harvest showed that the selected plant varied widely in their ability to remove and translo- cate DDTs and HCHs from the soil, the bioconcentration factor ranged from 0.004 to 0.027 for the shoot and from 0.036 to 0.097 for the roots, and the translocation factors were lower than 0.1 with variation between DDTs and HCHs, but no signifi- cant differences were observed. DDTs appeared to have accumulated by both pas- sive adsorption and active absorption, p,p'-DDT and p,p'-DDE were the major metabolite and the transformation was mediated by reductive dehalogenation, the affinity of the OCPs for lipids is one of the major factors affecting their uptake and translocation within the plants. 展开更多
关键词 Organochlorine pesticides PHYTOREMEDIATION removal rate MAIZE
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