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金属有机物PCVD法沉积Ti(CN)涂层 被引量:3

Ti(CN) layer deposited by organic-metallic PCVD
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摘要 应用PCVD技术,以金属有机物TPT作钛源在H13模具钢表面沉积Ti(CN)涂层,研究了不同工艺参数对涂层组织和性能的影响,并对涂层的抗氧化性进行了实验。结果表明,采用适当的沉积温度、压力及氮气流量,可以在H13钢表面得到以Ti(CN)为主的致密涂层,在沉积温度500℃时达到最高硬度HV1760,涂层在600℃以下具有良好的抗氧化性。 Using organic-metallic compound TPT as the source of Ti , H13 mould steel was coated Ti(CN) layer by PCVD technique, the effects of coating technics on the structure and micro-hardness and the anti-oxidation property of Ti(CN) layer were investigated. The results show that under the appropriate temperature and pressure, one layer mostly of Ti(CN) is formed on the steel surface which has highest micro-hardness of HV1 760 at 500 ℃,and the anti-oxidation property of the layer is significant below 600 ℃.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2004年第F01期272-275,共4页 The Chinese Journal of Nonferrous Metals
基金 湖北省教育厅资助项目(2002A01008)
关键词 金属有机物 PCVD Ti(CN)涂层 抗氧化性 模具钢 工艺参数 PCVD Ti(CN) layer anti-oxidation property
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参考文献5

  • 1Herranen M, Wiklund U, Hogmark S. Corrosion behavior of Ti/TiN multilayer coated tool steel[J] . Surface Coatings Technology, 1998, 99:191 - 196.
  • 2Mahowald M A, Ianno N J. Plasma-enhanced chemical vapor deposition of tungsten[J]. Thin Solid Film,1989(170): 91 - 97.
  • 3Hahn B H, Jun J H, Joo J H. Plasma conditions for the deposition of TiN by biased activated reactive evaporation and dependence of the resistivity on preferred orientation[A]. The 14th International Conference on Metallurgical Coatings [C]. USA: San Diego
  • 4Chung wan kim Anti -oxidation properties of TiAlN film prepared by plasma-assisted chemical vapor deposition and roles of Al[J]. Thin Solids Film, 1997,307: 113-119.
  • 5潘应君,吴新杰,李平生,张细菊.PCVD法在模具钢表面沉积Ti(CN)涂层的研究[J].金属热处理,2003,28(8):7-9. 被引量:9

二级参考文献3

  • 1Herranen M,Wiklund U,Hogmark S Corrosion behavior of Ti/TiN multilayer coated tool steel[J].Surface Coatings Technology,1998,99:191—196.
  • 2Mahowald M A, Ianno N J. Plasma-enhanced chemical vapor deposition of tungsten[J]. Thin Solid Film, 1989, (170):91-97.
  • 3Hahn B H,Jun J H,Jco J H. Plasma conditions for the deposition of TiN by biased activated reactive evaporation and dependence of the resistivity on preferred orientation[A]. The 14^th International Conference on Metallurgical Coatings [ C ], San Diego, CA, U. S. A.,1987.

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