摘要
针对惯性约束聚变(ICF)物理实验要求,提出并采用真空扩散连接技术,在高温环境下对Al/Cu薄膜进行连接研究。利用扫描电子显微镜(SEM)、X射线衍射(XRD)仪以及台阶仪等方法对连接样品基体组织和表面质量进行分析。结果表明:铝铜薄膜通过界面原子间的范德华力、冶金结合以及界面反应实现无胶连接。
According to the requirement of the ICF experiments, the vacuum diffusion bonding of the aluminum and copper films were studied in high temperature circumstances(250℃). The microstructures of the joint and surface roughness are analyzed by means of SEM, XRD and an alpha-step device. The results show that the force among atoms, metallurgy combination and interface reaction are important to obtain the high quality joint of the aluminum and copper films.
出处
《强激光与粒子束》
EI
CAS
CSCD
北大核心
2004年第5期607-610,共4页
High Power Laser and Particle Beams
基金
国家863计划项目资助课题
关键词
惯性约束聚变
扩散连接
铝
铜
薄膜
Inertial confinement fusion(ICF)
Diffusion bonding
Aluminum
Copper
Film
