摘要
讨论了退镀速度和防止基体受腐蚀问题,建议选用硫酸介质电解退镀.
Stripping rate and prevention of brass substrates from being etched are discussed. Electrolytic stripping of the deposits in a sulfuric acid solution is recommended.
出处
《电镀与涂饰》
CAS
CSCD
1992年第3期77-78,共2页
Electroplating & Finishing
