摘要
本论文综述了自二十世纪九十年代以来迅速发展的新型微电子封装技术,包括焊球阵列封装(BGA)、芯片尺寸封装(CSP)、圆片级封装(WLP)、三维封装(3D)和系统封装(SIP)等项技术。同时,叙述了微电子三级封装的概念。并对发展我国新型微电子封装技术提出了一些思索和建议。
This paper describes the advanced microelectronics packaging technology which has developed rapidly during the 1990.The technology includes BGA, CSP, WLP, 3D packaging , SIP etc.And it introduces the concept on three level packaging.In addition it gives some considerations and suggestions for developing the advanced microelectronics packaging technology in china.
出处
《电子与封装》
2004年第1期10-15,23,共7页
Electronics & Packaging
