摘要
使用光刻仿真工具模拟掩模图形到硅圆片的转移成像结果 ,可以分析集成电路在工艺规则下产品的可靠性和部分电学特性 基于Gabor的“主波分解”方法 ,一个部分相干成像系统可以用相干成像系统的叠加来近似 ,再对空间图像进行高斯卷积来模拟光刻胶的实际扩散效应 ,从而获得一种精确、快速用于光刻模拟的稀疏空间点光强计算方法 根据光学系统的传输交叉系数的特性 。
Yield rate, reliability and electrical characteristics of ICs can be investigated to a certain degree by simulation of the transferring process from mask patterns to silicon image Based on Gabor's method of 'reduction to principal waves', a partially coherent imaging system is represented as a superposition of coherent imaging systems A Gaussian convolution representing the inhibitor diffusion is subsequently applied to the aerial image An accurate and fast method to calculate intensities of sparse aerial points is derived based on the early approaches Two matrix decomposition methods, which take advantage of the fact that the transmission cross coefficient (TCC) of a stepper is Hermitian, are also presented and discussed
出处
《计算机辅助设计与图形学学报》
EI
CSCD
北大核心
2003年第7期783-786,794,共5页
Journal of Computer-Aided Design & Computer Graphics
基金
国家自然基金 ( 60 1760 15 )资助
关键词
光刻仿真
集成电路
可靠性
电学特性
矩阵分解
lithography simulation
Optical Proximity Correction (OPC)
matrix decomposition
