摘要
综述了近年来国内外关于瞬间液相扩散连接数值模拟的研究现状,内容涉及了异种材料接头元素的扩散与反应层形成的模拟,接头变形与应力行为的模拟,并提出了要解决的问题,为今后的研究提供了一定的借鉴。
Reviews the present progress in numerical simulation of transient liquid phase diffusion bonding in recent years. The simulation of element diffusion and formation of reaction layers are discussed in detail. At the same time the simulation of residual stress of the bonding is involved. The problems to be solved are pointed out. It could be useful for the future research.
出处
《华东船舶工业学院学报》
2003年第6期42-47,共6页
Journal of East China Shipbuilding Institute(Natural Science Edition)
基金
江苏省自然科学基金项目(BK2002602)
关键词
瞬间液相连接
数值模拟
元素扩散
残余应力
transient liquid phase bonding
numerical simulation
element diffusion
residual stress
