摘要
采用Ni箔和Cu/Ni/Cu多层箔作中间层在 92 3K进行了SiC颗粒增强铝基复合材料的瞬间液相连接。研究表明 ,无压连接时 ,接头强度随保温时间延长有所增高 ,但界面处会存在纯金属 (无增强颗粒 )区域和氧化物夹杂 ,是导致接头强度不高的主要原因。加压TLP连接则能有效改善界面组织和接头性能。采用Cu/Ni/Cu多层箔作中间层加压连接时接头强度可达 189.6MPa ,约为母材强度的 85 %。
Transient liquid phase bonding of SiC P/Al metal matrix composite was performed using Ni interlayer and Cu/Ni/Cu multi interlayer at temperature of 923K.The results suggested that joint strength increased with the increase of bonding time.The presence of pure metal region without the reinforced particles and oxide at joint interface caused the joint strength to decrease.Applying pressure during bonding could improve interfacial structure and increase joint strength.Using Cu/Ni/Cu multi interlayer and 0.2MPa pressure during TLP bonding,the strength of 189.6MPa could be obtained.In addition,the effect of applied pressure on joint strength,as well as the interfacial character in metal matrix composite bonding was also discussed in detail.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2001年第6期57-60,共4页
Transactions of The China Welding Institution
基金
江苏省青年基金资助项目 (BQ980 2 1)
关键词
铝基复合材料
瞬间液相连接
中间层
界面结构
连接强度
碳化硅
SiC P/Al metal matrix composite
transient liquid phase
interlayer
interfacial structure
joint strength
