摘要
用相对电导率、硬度的测量、金相分析及透射电镜等方法,研究了Cu 15Ni 8Sn 0.4Si合金在380℃时效过程中组织结构及性能的变化。结果表明,时效过程中,细小Ni2Si颗粒的析出对不连续沉淀有一定抑制作用;随时效时间增加,抑制作用减弱;Cu 15Ni 8Sn 0.4Si合金的电导率、硬度比Cu 15Ni 8Sn合金高。
By means of measurements of conductivity and hardness, metallographic analysis and TEM, the change of properties and microstructure of Cu-15Ni-8Sn-0.4Si alloy was studied during 380℃ aging. The results show that the precipitation of small Ni_2Si particles can restrain the discontinuous deposition to some degree. With increasing time, the action is weakened. The conductivity and hardness of Cu-15Ni-8Sn-0.4Si alloy are higher than those of Cu-15Ni-8Sn alloy.
出处
《机械工程材料》
CAS
CSCD
北大核心
2003年第11期15-17,共3页
Materials For Mechanical Engineering
基金
国家863高技术研究发展计划基金资助项目(2002AA302505)
