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CrCl_3对酸性化学镀Ni-Cu-P镀液镀层性能的影响 被引量:2

Behavior of CrCl_3 in Acidic Electroless Plating Ni-Cu-P Solution
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摘要 研究了CrCl3对酸性化学镀镍铜磷合金溶液的稳定性、沉积速度以及镀层成分、表面断面形貌的影响,并与文献报道的其他Ni-Cu-P镀液的稳定剂进行了比较.结果表明:CrCl3能有效地抑制镍铜磷镀液的分解和铜在基体上的置换反应,得到更高铜含量的光亮镀层;随着CrCl3在镀液中含量的增加,沉积速度先升后降;CrCl3的加入使镀层中铜含量略微降低,镍磷含量增加;与其他稳定剂一样,CrCl3不改变沉积层的岛状表面形貌;断面形貌表明镀层仍保持致密. The effects of CrCl3 on the stability and deposition rate of acidic Ni-Cu-P solution, composition and performance of the coating and surface, sectional morphology of Ni-Cu-P coating were investigated. The differences between those with CrCl3 as stablizer and the other stablizers reported were compared. The results show that CrCl3 can effectively inhibit the decomposition of Ni-Cu-P plating solution and the replacement reaction occurrance of Cu on substrate. The deposition rate firstly increases, then decreases with the increasing CrCl3 content; the coatings with CrCl3 in solution have more Cu content and less Ni and P content. Like other stablizers, CrCl3 does not change the island surface morphology of coatings and the coatings are sound according to the sectional morphology. The performance of the coating with CrCl3 in plating solution is better than that of the other stablizers reported in Ni-Cu-P solution.
出处 《上海交通大学学报》 EI CAS CSCD 北大核心 2003年第10期1540-1543,共4页 Journal of Shanghai Jiaotong University
关键词 化学镀 稳定剂 CrCl3 镀液性能 镀层性能 Chromium compounds Coatings Deposition Surface topography
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