摘要
用XCD-H红外电视测微显微镜,通过无损检测来评价半导体材料与器件工艺的质量。本文仅对材料的完整性与芯片制造工艺导致杂质沉淀的问题进行讨论。
The semiconductor material integrity and the impurity and the impurity precipitation from the wafer process are discussed by using XCD-H infrared microscope with television micrometer……one of the nondestructive inspection method.
关键词
杂质沉淀
无损检测
电视显微镜
impurity precipitation
infrared televised microscope
nondestructive inspection
