摘要
提出了一种利用X射线应力分析技术和应变电测法测量附着膜的等效应力———等效单轴应变、屈服强度和加工硬化指数的方法。利用该方法测得一种厚度为2.5μm的TiN膜的条件屈服点σ0.1和σ0.2分别等于4.2GPa和4.4GPa,加工硬化指数n为0.36;对于一种厚度为2.4μm的铜膜,得到σ0.1=328MPa,σ0.2=415MPa,n=0.62。利用无应变剥层技术逐层剥离薄膜,同时测量基片曲率半径的变化,由此测得了一种厚度为2.3μm的TiN膜的残余应力沿层深分布。用新建立的一种利用X射线应力分析法测量薄膜泊松比的技术,测出一种TiN膜的泊松比等于0 27。给出了测量陶瓷膜的杨氏模量的设想。
A new method is presented to measure the equivalent stress-equivalent uniaxial strain curve, yield strength and strain-hardening exponent of a polycrystalline film on substrate using X-ray stress analysis and strain gauge techniques. Using this method, the obtained proof stresses corresponding to permanent equivalent uniaxial strain 0.1% and 0.2% are 4.2GPa and 4.4GPa respectively for a 2.5μm thick TiN film, and 328MPa and 415MPa respectively for a 2.4μm thick Cu film. By stepwise removal of a TiN film having a thickness of 2.3μm and measuring the variation in substrate curvature, the depth distribution of the residual stress in the film were acquired. A new technique for measuring the Poisson′s ratio of thin films using X-ray stress analysis technique is proposed, and the measured value for a TiN film is 0.27. A tentative idea for getting the Young′s modulus of ceramic films is also put forward in this paper.
出处
《理化检验（物理分册）》
CAS
2003年第9期441-446,共6页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
基金
国家自然科学基金资助项目(59931010
50272067)
