摘要
对LED封装过程可能出现的问题逐一指出,并提出解决的办法,着重介绍封装位置对LED发光亮度的影响。以期引起LED封装管理人员及工作人员的注意。
Point out the possible problems during LED packaging and put forward the relative solutions.Introduce emphatically impact of packaging position on LED lightness,cause LED packaging management and manufacture pay attention to it.
出处
《电子工艺技术》
2003年第4期172-173,176,共2页
Electronics Process Technology
关键词
质量控制
点胶
点晶
焊线压力
放大率
QC
Adhesive deposite
Crystal placement
Bonding pressure
Magnifying
