摘要
介绍了MEMS(microelectromechanicalsystems)封装技术的研究现状和存在的问题,重点介绍了倒装芯片技术(flip chiptechnology简称FCT)、上下球栅阵列封装技术和多芯片模块封装技术三种很有前景的封装技术的特点及其在MEMS领域的应用实例,并且对MEMS封装有可能的发展趋势进行了分析。
The state of the art of the MEMS(micro electromechanical systems) packaging technologies and the problems are described.Three promising technologies and their examples including the FCT(flipchip technology),TBBGA(top bottom ball grid array) and MCMs(mutichip modules) are especially discussed.A forecast is given for their future trends.
出处
《传感器技术》
CSCD
北大核心
2003年第5期58-60,共3页
Journal of Transducer Technology
