摘要
研究了固溶时效对高体积比 Si Cp/Al复合材料的导热性能及抗弯强度影响。研究发现 :热处理改变了复合材料 Si Cp/Al界面结合状况 ,提高了导热性能 ;同时强化了基体合金 ,改变了 Si Cp颗粒所受应力状态 ,提高了复合材料的强度 ,使高体积比 Si Cp/Al复合材料的导热系数达到 2 1 0 W/( m· K) ,抗弯强度达到 5 1 9MPa。
Solution hardening and aging treatment was applied to SiC p/Al composite with high SiC p particles content and its influence on the thermal conductivity and strength was evaluated It can be concluded that the heat treatment leads to the increment of the thermal conductivity through improvement of the interface bonding and the thermal conductivity factor can be high as 210 W/(m·K) The heat treatment also strengthens the Al alloy and leads to the change of the SiC p particles' stress condition, and therefor increases the composite's strength which can be high as 519 MPa
出处
《湖南冶金》
CAS
2003年第3期16-19,共4页
Hunan Metallurgy
基金
国家"九五"攻关项目 ( 95-YS- 0 0 5 )
关键词
高体积比SiCp/A1复合材料
固溶时效
导热系数
抗弯强度
SiC p/Al composite with high SiC p particles content
solution harding and aging treatment
conductivity factor
bending strength
