摘要
本文找到了一种具有较高致冷系数和较大致冷量的设计方法。在保证上述条件下,本文分析了最佳工作电流和半导体致冷器的工作温度,半导体材料的优值系数等参数之间的关系。
This paper has found the design method which has higher refrigeration coefficient and bigger refrigeration capacity. Under above conditions the paper has analysed the relationship between the working temperature of semi-conductor device, high quality coefficient of semi-conductor material.
出处
《哈尔滨工业大学学报》
EI
CAS
CSCD
北大核心
1992年第1期28-33,共6页
Journal of Harbin Institute of Technology
