摘要
提出一种金刚石膜热沉表面金属化新工艺。该工艺采用Ti Ni Au体系和电子束真空镀膜方法 ,并经过金刚石膜预处理和后续低温真空热处理获得了良好的结合性能。研究表明 :预处理对金属层和金刚石膜的结合强度影响显著 ,结合强度由原来的 1 4 0MPa提高到 48 9MPa ;金刚石膜 Ti Ni Au经过 1 0 0次从 2 0 3K到 42 3K冷热循环 ,金属和金刚石膜之间没有发现脱膜现象。XRD进一步证实 :经过后续 673K× 2h低温真空热处理 ,Ti 金刚石膜界面形成TiO和TiC。Ti和金刚石膜之间的扩散与反应产物不仅取决于反应温度 。
A novel metallization proceeding on CVD diamond substrates for heat sink is reported. The good adhesion strength between metal layers and diamond substrates can be obtained by pre fire and post treatment processing using electron beam evaporation techniques and Ti/Ni/Au metallization system. The results show that the adhesion strength can be significantly improved from un pretreatments 14 0MPa to 48 9MPa by the pre fire of the bare diamond substrates. The system diamond /Ti /Ni /Au indicates excellent adhesion after thermal cycling 100 times between 203K and 423K and there are no signs of delamination. Further, XRD confirms that the Ti layer reacts with the diamond substrates to form TiC and TiO species on the interface during post deposition annealing 673K×2h in vacuum. The interface diffusion or reaction of Ti/diamond depend on not only the temperature but also the surface conditions of the diamond.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2003年第1期59-62,65,共5页
Transactions of Materials and Heat Treatment
基金
河北省重大科技攻关项目 ( 95 97 0 6 )
