摘要
评述了用鼓膜实验方法测试薄膜与基体界面结合强度的现状和最新进展,分析了该方法针对圆孔、膜内无残余应力柔性膜试样和矩形孔或圆孔、膜内有残余应力试样(薄膜为柔性膜或刚性膜)所用解析解力学模型建立的薄膜力学性能假设前提条件、能量平衡思路和推导过程．介绍了用硅微技术制备Si基体试样的过程,指出了制备方法和解析解力学模型的特点及所存在的问题．给出了该实验方法的应用实例,指出了需要解决非硅基体的制样和薄膜塑性变形阶段力学模型等问题．
The current status and the new progress of blister tests for measuring interfacial adhesion strength between film and substrate are reviewed in this article. The assuming precondition for the thin film＇s mechanics behavior, the argument means related to energy-balance and the deduction of the analytical mechanics models in blister test for the thin films with circular window and thin films with rectangular/square window, which have and have no residual stress, are analyzed especially. The micromachining process fabricating free-standing thin film window on Si substrate is introduced. Stressed is the status of the mechanical model and fabrication technique of specimens used in the test, including their advantages and disadvantages, and some application samples of blister test are given. Moreover, the future work should be carried out in the establishment of the mechanical model in plastic deformation phase and the fabrication of non-silicon substrate specimen.
出处
《材料研究学报》
EI
CAS
CSCD
北大核心
2006年第4期346-353,共8页
Chinese Journal of Materials Research
基金
国家自然科学基金59831040
河南省自然科学基金0411050100
河南省高等学校青年骨干教师资助计划(2005-461)
河南省科技攻关0424290064资助项目.~~
关键词
薄膜
鼓膜实验
界面结合强度
力学模型
残余应力
thin film, blister test, interfacial adhesion strength, mechanical model, residual stress
