摘要
本文从理论上分析了单模光纤与行波半导体激光放大器之间的耦合特性,导出一套简捷的设计光纤耦合头公式,比较不同的结构参数对光纤头耦合性能的影响,选出一种最佳设计方案.经实验验证.采用本文提出的光纤头微透镜处理技术,可使光纤-光放大器耦合损耗降至-3dB.
The technique of a single-mode fiber coupling with a Travelling-wave Semiconductor Laser Amplifier (TW-SLA) was investigated theoretically. A set of simple and useful formulas were developed for designing the fiber ends. The coupling characteristics of the fibers having hemispherical sphere ends (HE), inter-taper-with-hemisphere ends (IE) and outer-taper-with hemisphere ends (OE) wore compared each other and analyzed. It was confirmed that the coupling efficiency a from fiber into TW-SLA chip is much greater for the cases of IE and OE than for HE, with OE being the most efficient. A -3 dB coupling loss between fiber and TW-SLA chip has been obtained with the optimum fiber ends in our experiments.
出处
《光学学报》
EI
CAS
CSCD
北大核心
1992年第4期308-312,共5页
Acta Optica Sinica
基金
国家863资助项目
