摘要
介绍了一种微系统集成的新技术——SIP,并将其与SoC进行了比较。阐述了SIP的优势和应用,指出SIP将会为微系统集成技术带来更大的发展。
A new technology of micro-system integrated system in package(SIP) is introduced,and compared with system on chip(SoC). The advantages and applications of SIP are given. Thedevelopments of micro-system integrated technology which SIP will bring about are suggested.
出处
《半导体技术》
CAS
CSCD
北大核心
2003年第2期11-12,16,共3页
Semiconductor Technology
关键词
SIP
系统级封装
片上系统
微系统集成技术
SOC
system in package(SIP)
system on chip(SoC)
technology of micro-system integrated
