摘要
为降低陶瓷与陶瓷或金属的连接温度 ,目前采用的连接方法有过渡液相扩散连接、半固态连接、机械连接、粘接、铟封和陶瓷表面低温改性后低温钎焊等。本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。
To lower the bonding temperature of ceramic to ceramic or metal, several methods have been used. These methods include transient liquid phase bonding, semi solid bonding, mechanical bonding, cementation, indium sealing, low temperature soldering after ceramic surface property improvement at low temperature and so on. This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantages and disadvantages, etc.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2002年第6期1-5,13,共6页
Aerospace Materials & Technology
基金
航天科技创新基金
清华大学骨干人才支持计划
国家自然科学基金项目 :5 0 0 75 0 46
关键词
金属
连接温度
陶瓷
低温连接
过渡液相扩散连接
半固态连接
表面改性
Ceramics, Low temperature bonding, Transient liquid phase bonding,Semi solid bonding, Surficial modification
