摘要
采用共晶烧结工艺对Ａｌ_２Ｏ_３。陶瓷进行表面Ｃｕ金属化，并采用刮擦针焊的办法实现了陶瓷与Ａｌ的低温连接。实验结果表明，钎料与Ａｌ基体和金属化层之间均有良好的冶金作用，能够保证接头的强度，而且钎焊过程不会对金属化层／陶瓷界面造成不良影响。
Cu metalliaxtion of alumina ceramic surface was completed by eutectic sintered process.And, the metallized alumina was bonded to Al at low temperature using scrape-brazing process.The test result showed that the brazing filler metal had better action to Al and metallization layer ,which could insure the strength of joint. In addition,the bionding process had not any bad influence on the interface between alumina and metallization layer.
出处
《焊接》
2000年第10期9-12,共4页
Welding & Joining
关键词
低温连接
陶瓷表面金属化
刮控钎焊
铝
low temperature bonding, metallization of ceramic surface, scrape brazing
